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BOOK EXCERPT: The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, Chapter 4

12/31/2024 | I-Connect007
Bio-based encapsulation resins have the potential to contribute to sustainability targets by extending product lifetime and improving performance. The author explores the use of recycled materials such as biogenic waste and lightweight expandable polymers to create more efficient and environmentally friendly encapsulation resins.

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

12/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance

12/25/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.

Zhou (Peter) Guoyin: Pioneering the Standardization of ESG

12/23/2024 | Chuck Li, IPC Asia
With more than 30 years of experience in corporate social responsibility (CSR) and environmental, social, and governance (ESG), Zhou (Peter) Guoyin has not only witnessed the evolution of CSR and ESG globally but has also been a key force in driving their development. As chair of the IPC-1401 standard committee, Zhou has led numerous innovative projects over the past 11 years and was awarded the SEDEX Supply Chain Impact Award in August 2024. In this exclusive interview, he shares valuable insights into the ESG field and the profound impact of IPC-1401 on the electronics manufacturing industry.

CHIPS Act Funds SK hynix's $3.87 Billion Investment in U.S. Semiconductor Supply Chain

12/19/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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