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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC APEX EXPO 2024 Offers More Than 100 Technical Sessions in Electronics Manufacturing
January 23, 2024 | IPCEstimated reading time: 1 minute
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO 2024, features cutting-edge technical content directly influencing the $2 trillion global electronics manufacturing industry. Attendees will have more than 100 opportunities to update their technical knowledge during sessions at IPC APEX EXPO 2024 from April 6-11, 2024, in Anaheim, Calif.
“Our technical conference and professional educational program feature the highest quality technical content from technical experts representing three continents,” said Julia Gumminger, IPC manager, professional development and events. “Industry experts representing global enterprises and small companies will present novel, unpublished data and share their innovations in a wide range of fundamental and emerging topics.”
Unique to 2024, IPC APEX EXPO will host the Electronic Circuits World Convention (ECWC16) Technical Conference, an expanded, global technical symposium featuring more than 70 presentations over nine technical tracks: PCB Fabrication and Materials; Design; Assembly Process and Materials; HDI uHDI and Substrates; Sustainability for Electronics; High Reliability; Factory of the Future; Emerging Technologies; and Quality, Reliability, Test and Inspection.
Authors from around the globe will present their new, unpublished results, to share developments and innovations in materials, techniques, processes across the spectrum of the electronics manufacturing supply chain. Two special technical sessions will feature invited speakers on advanced packaging and e-mobility and EV automotive. The technical conference will be held April 9-11.
IPC APEX EXPO 2024 will provide more than 30 professional development course sessions delivered by technical experts, corporate technologists, and peer leaders in the industry. The professional development courses, covering such topics as artificial intelligence, PWB design engineering, 3-D printing, Li-ion battery technology, and proactive design methods for approaching zero-field failures, will provide attendees the opportunity to build their professional and technical skills and increase their knowledge in techniques, materials, and trends in all aspects of the industry. Professional development courses will be held April 7-8, and April 11.
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Klaus Koziol - atgSuggested Items
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.