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Experience the Future at TRI's Innovation Seminars
January 24, 2024 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI) will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou. Each of the one-day events will focus on the latest test and inspection technology innovations for SMT and Advanced Packaging production, including the Smart Factory and AI-powered Solutions.
TRI's 2024 portfolio will showcase High-Speed Line inspection platforms, such as the TR7700QH SII, capable of inspecting at speeds of 80cm²/s. During the seminars, there will be a demonstration of TRI's High-Accuracy and High-Resolution line for Advanced Packaging Inspection. The lineup will also feature X-ray Inspection demonstrations, such as the 3D CT AXI TR7600F3D LL SII with an improved platform for High-Speed Inspection.
Additionally, TRI will showcase Board Testing platforms, such as the TR5001 SII series with LED Analyzer for Automotive applications and the High-Pin Count Tester TR8100HL SII for High-throughput production lines. Lastly, there will be a live demo of TRI's AI-powered Solutions and the improved Yield Management System 4.0 (YMS 4.0).
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New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.