Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Exploring Cold Milling as an Alternative PCB Component Removal Method
January 24, 2024 | Bob Wettermann, BEST Inc.Estimated reading time: Less than a minute
When a PCB undergoes multiple heat cycles, inherent risks emerge, primarily due to the expansion and contraction of materials. This thermal stress can induce various issues, including delamination, warping, compromised solder joints, and damage to heat-sensitive components like integrated circuits or capacitors.
To counter these risks, one approach involves a unique process called "cold milling," designed to mitigate the adverse effects of additional thermal stress. Unlike traditional methods involving direct heat application, this solution utilizes a laser-guided precision mill to remove components. This ESD-safe process includes a vacuum nozzle that simultaneously removes debris during the milling process, ensuring cleanliness.
The genesis of “cold milling” stems from a customer's challenge with removing underfilled BGAs. They encountered issues with underfill leaching into the adjacent solder during reflow, causing solder shorts. By utilizing this cold milling process, we were able to remove the component without applying heat and place a new component in its place resulting in a yield >90% and a successful solution for the customer.
To read this entire article, which appeared in the January 2024 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
Rules of Thumb for PCB Layout
11/21/2024 | Andy Shaughnessy, I-Connect007The dictionary defines a “rule of thumb” as “a broadly accurate guide or principle, based on experience or practice rather than theory.” Rules of thumb are often the foundation of a PCB designer’s thought process when tackling a layout. Ultimately, a product spec or design guideline will provide the detailed design guidance, but rules of thumb can help to provide the general guidance that will help to streamline the layout process and avoid design or manufacturing issues.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications
11/20/2024 | InfineonInfineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.