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Material Insight: The Importance of Standards for the Chip Packaging Industry

04/12/2024 | Dr. Preeya Kuray -- Column: Material Insight
I had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.

Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions

04/10/2024 | Infineon
Infineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.

Indium’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan

04/02/2024 | Indium Corporation
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024).

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/29/2024 | Marcy LaRont, PCB007 Magazine
We are well into trade show season and what a season it has been so far! SMTA Dallas, IMAPS, and the SMTA UHDI Symposium have filled out the past two weeks as we barrel toward IPC APEX EXPO in just a week’s time. There have been many exciting announcements of equipment and technology that will be showcased at IPC APEX EXPO, including announcements from Ventec, Blackfox, Insulectro, Indium, and more. Click through the news to see what’s in store for the big show.

The IMAPS Show: A Conversation with John Andresakis

03/26/2024 | Marcy LaRont, PCB007 Magazine
On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
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