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I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging.
As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
In this issue:
• The Critical Minerals: Electronics Quandary
What happens when the world’s mineral supply chain runs through China? USPAE’s Jim Will shares his perspective on gallium, copper, and the urgent need to secure and diversify the U.S. electronics supply chain.
• Interposers and Substrates in Advanced Manufacturing
As Moore’s Law slows, advanced substrate and interposer technologies are stepping in to extend performance gains and push integration to new levels.
• Beyond Thermal Control
From automotive to aerospace, reliability is everything. Discover how the new IPC-4556 ENEPIG update helps finishes meet the industry’s most demanding performance requirements.
Don’t miss the discussions shaping the next era of electronics manufacturing.
Subscribe now to receive Advanced Electronics Packaging Digest directly in your inbox and stay ahead of the trends driving advanced packaging innovation.
