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Suggested Items

The Right Blend: Mixed Wireless Technologies

05/08/2025 | Kirsten Zima, Siemens EDA
A common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.

Ericsson, Nokia, ANDREW, and Huawei Take Top Spots in ABI Research’s DAS/DRS Vendors Competitive Ranking

05/07/2025 | ABI Research
Driven by the growing demand for seamless connectivity and 5G readiness, the Distributed Antenna System (DAS) and Distributed Radio System (DRS) market is shifting toward more intelligent, scalable solutions tailored to diverse enterprise environments.

INVISIO Further Expands Capability of Market-Leading Wireless Intercom System

05/05/2025 | INVISIO
Tactical communications expert INVISIO is expanding the capability of its market-leading intercom system made for tailored user and radio communication. The expansion will deliver enhanced mobility, flexibility, interoperability and functionality for mission-critical users.

Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship

04/21/2025 | IPC
IPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship.

Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.
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