-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Robotics Releases New YRM10, Next-generation Compact High-speed Modular Mounter
January 30, 2024 | Yamaha RoboticsEstimated reading time: Less than a minute

Yamaha Robotics announced that the new YRM10, a surface mounter that is the world's fastest in 1-Beam/1-Head class mounting performance of 52,000 CPH will be available for purchase from March 1, 2024. This new addition is a next-generation, compact, high-speed modular with space-saving qualities, and provides a combination of component compatibility and versatility.
Bringing together a combination of high-speed and versatility with excellent cost performance, the new YRM10 was developed as a successor to the entry model YSM10.
While maintaining the compact size of the YSM10, this new one uses the next-generation YR series platform and introduces the latest technologies such as high-speed general-purpose versatility head and vision systems from the high-end premium high-efficiency modular YRM20.
The 1-head solution mechanism consisting of 10 in-line heads and scan camera supports a wide range of components while maintaining high speed without the need for head replacement, and simultaneously achieving high mounting accuracy of ±35 μm (Cpk ≥ 1.0).
In addition to supporting high-density mounting of 0201 (0.25 x 0.125 mm) sized ultra-small chips to medium-sized or odd components, production quality capabilities are further improved by equipping the system with a side-view camera and optionally setting a coplanarity checker that detects components with a floating lead.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
Amphenol Releases 2024 Sustainability Report
04/22/2025 | Amphenol CorporationAmphenol Corporation released its 2024 Sustainability Report.
The World's Smallest PPG Sensor Head
04/04/2025 | BUSINESS WIRESCIVAX Corporation and TSLC Corporation, a SemiLEDs Corporation wholly owned company announced that SCIVAX+TSLC have developed the world's smallest PPG (PhotoPlethysmoGraphy)* sensor head, which will be presented at the display related technology exhibition ”Touch Taiwan” to be held in Taipei, Taiwan from April 16 to 18, 2025. The samples of the PPG sensor head for evaluation will begin in April 2025.
ASMPT Strengthens its Global Footprint
03/21/2025 | ASMPTASMPT, the global market and technology leader for hardware and software solutions in the semiconductor and electronics industries, continues to drive the growth of its semiconductor solutions in strategically important markets.
ASMPT: New Stationary Camera for SIPLACE Placement Machines
03/13/2025 | ASMPTMarket and technology leader ASMPT is offering a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN. It delivers significantly faster processing speeds as well as more component flexibility – from highly integrated ball grid arrays (BGAs) to large-format odd shape components (OSCs).