-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Electronics Industry Mourns Loss of Colleague and Visionary Michael Ford
January 31, 2024 | I-Connect007Estimated reading time: 2 minutes
Longtime I-Connect007 columnist, industry visionary, and friend Michael Ford passed away Saturday, Jan. 27, 2024. “In this time of sorrow, we can take solace in the knowledge that Michael leaves a great legacy of contribution to the electronics industry,” according to a statement from Aegis Software.
Michael was senior director of emerging industry strategy at Aegis. He was a prolific writer and speaker whose work and ideas put him at the forefront of electronics manufacturing. Working for Aegis gave him the opportunity to apply his software for electronics manufacturing experience to further drive technology solution innovation.
In the statement from Aegis, Michael was described as “always envisioning what was needed to achieve an improved manufacturing future before others could see it. What new system, standard, or concept could help move things forward for the better? Michael could move those ideas to the forefront and was always seeking the views and ideas of others in the process. He had a singular gift in helping everyone he encountered see the future with him in his articulate and compelling way that brought everyone into the process, whether an individual or a full conference hall.”
He started his career with Sony, including eight years working in Japan. He was instrumental in creating and evolving software solutions for assembly manufacturing that meet the most demanding expectations. He was an established thought leader for Industry 4.0 and digital Smart factories, and an active contributor to industry standards.
In 2020, Michael was given the IPC President’s Award as recognition for contributions, including CFX, traceability, secure supply-chain and digital twin standards.
In 2021 Michael was awarded the Dieter Bergman IPC Fellowship Award and chose Villanova University’s engineering department as the recipient of the grant which in turn awards a scholarship to benefit the promotion of opportunities for women in the industry.
His column for I-Connect007 was titled Smart Factory Insights, and he frequently took commonly-held ideas and pushed the boundaries of current thinking. He often found ways to improve business operations or create new business models that built off current frameworks.
“Michael has been such a generous and knowledgeable columnist for so long,” says Pete Starkey, a technical editor for I-Connect007. “He was a genuinely lovely man and a worthy recipient of our ‘Good for the Industry’ award. I can’t believe he’s gone.”
One time we asked him for his sage advice and he said, "Always keep an open and progressive mind. Listen to and understand perspectives from all of those around you."
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
The Next Generation of Leadership: New Student Board Member Aubrey Smith
04/10/2026 | Marcy LaRont, I-Connect007At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
04/09/2026 | ASC Sunstone CircuitsASC Sunstone Circuits, a division of American Standard Circuits, has implemented Smart PartsTM Classics technology at its Mulino, Oregon, manufacturing facility, advancing its commitment to efficient, high-quality PCB fabrication.
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
04/09/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfI just finished "The NVIDIA Way" by Tae Kim, and let me tell you, this isn’t just a book about a semiconductor company. It’s a book about conviction, stubborn vision, and, most of all, what happens when a leader refuses to think small. At the center of it all is Jensen Huang. Kim does a masterful job showing us that NVIDIA’s rise wasn’t luck, timing, or some Silicon Valley fairy dust. It was discipline and obsession. It was long-term thinking in a world addicted to quarterly results.
Meet Emerging Engineer Logan Bistodeau, IBM
04/09/2026 | Michelle Te, I-Connect007When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.