Championing Innovation: IPC WinterCom 2024 Takes Barcelona by Storm

Estimated reading time: 4 minutes

Barcelona played host this month to IPC WinterCom 2024, a groundbreaking industry event that sparked a surge of excitement amongst the global electronics manufacturing industry. Imagine the vibrant atmosphere of passionate minds from nearly 40 countries converging to shape the future of electronics manufacturing. This weeklong extravaganza wasn't just a conference; it was a celebration of collaboration and innovation.

Close to 300 industry leaders from PCB, EMS provider, and supplier companies across the global supply chain gathered for face-to-face sessions and discussions. The standards development committees delved into diverse topics, ranging from materials, design, and printed board fabrication to cutting-edge realms like the Factory of the Future, e-textiles, and 3D plastronics.

As IPC staff engaged with the attending industry representatives, their conversations unveiled new potential within standards in Europe, eager to contribute to the electronics manufacturing industry. The recipe for engagement was found, and it was clear that Europe plays a pivotal role in shaping the industry's future. It was important to get Europeans engaged in some of the newer standards development discussions like cold joining, digital twin, sustainability, e-textiles, and in-mold electronics, because many of the subject matter experts for these areas reside in Europe. IPC staff members Chris Jorgensen, Andres Ojalill, and Francisco Fourcade recognized this opportunity as a significant advantage as they were able to leap forward with the work during WinterCom.

In sync with the industry's evolving needs, IPC's focus on design found a perfect stage. Peter Tranitz leads IPC’s Design Leadership Council, and gathered support from industry leaders[AG1] , as well as regional groups like the French Design Council. Having witnessed the committee members’ enthusiasm, we could anticipate being able to deliver new tools and services to help designers in the near future.

One of the standout moments of the event was the progress of the D-83A In-Mold Electronics Interconnection Task Group. Their IPC-840, Guidelines for In-Mold Electronics, moved to the Final Draft for Industry Review phase. With the help of this standard, the industry will have an industrial approach to integrating printed electronics and electrical components into 3D-shaped injection molded parts.

Simultaneously, a new chapter in IPC-2231, Design for Excellence (DFX), was discussed. The DFX standards subcommittee room buzzed with excitement, hinting at new improvements and areas for innovation.

The ninth edition of the Smart Plastics Congress, held alongside WinterCom, was a technical conference of high demand. Attendees were treated to insights from industry experts and a visit to a local plastronics pilot plant. The congress was a melting pot of research results and technological marvels, showcasing the cutting edge of surface functionalization with printed electronics and 3D plastronics.

We were joined by a very special guest, engineering student Lauriane Testuz. She is interested in an internship in the industry where she can explore career opportunities, broaden her knowledge of the industry, and learn new skills. IPC invited Lauriane to participate in WinterCom and meet industry leaders as as way to unlock new opportunities that support her interest in printed[AG2]  board design and enhance her career options. Lauriane attended many committee meetings and participated in networking lunches, which gave her a unique outlook on the global electronics manufacturing industry.

"I was a little nervous at the start of the event because of its magnitude, but as it went on, I became more confident in networking,” she said. “I learned a lot about design while attending committee meetings and consider myself lucky as not every engineering student gets such an opportunity. It was an enriching experience professionally, socially, and culturally.”

She continued, "They do not teach us standards in school, and I think it is a shame. Once we get our degree, we have no knowledge of how a board has to be made and according to which guidelines. I now learned that there are strict rules that one must adhere to when assembling a board, and students should be taught how to do it the right way, starting in the university. I would encourage all students to take advantage of opportunities like this. There are things that you cannot learn in school, and you have to be here to witness it yourself.”

WinterCom's European location, coupled with its global participation, reiterated IPC's commitment to fostering international collaboration on standards, even in a world marked by geopolitical challenges. The event showcased how standards development activities act as the unsung heroes shaping the future of electronics manufacturing. It wasn't merely about meeting today's needs; it was about paving the way for the evolving landscape of tomorrow.

Adding a touch of playfulness to the proceedings were IPC’s mascots, Clumpy and Kloumpios. Beyond being present for photo-ops, our gnomes made appearances in committee meetings to “support” industry leaders. Trading cards featuring the mascots were shared among the multiple A-Teams, serving as both collectibles and reminders of the fun and engagement that Clumpy and Kloumpios could bring to the standards development committee meetings.

Sanjay Huprikar, IPC president of Europe and South Asia operations, summed up IPC’s vision on standards by encapsulated the event's spirit with the phrase “for industry by industry.”

“I taught that phrase to a dozen people over the four days we were there,” Huprikar said. “Just like ‘build electronics better, I think that phrase will become sticky soon. We should probably translate ‘for industry by industry’ into every one of Europe’s official 24 languages and dedicate a full poster to it at electronica in November.”

IPC WinterCom 2024 was more than a conference; it was a testament to the industry's resilience, adaptability, and commitment to building electronics better. In Barcelona, innovation wasn't just discussed; it was celebrated and it set the stage for a future where the electronics industry continues to be at the forefront of technological evolution.