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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

LITEON Announces Strategic Investment in Liquid Cooling Technology Company DCX

09/03/2026 | BUSINESS WIRE
LITEON Technology announced a strategic investment in DCX POLSKA Sp. z o.o., a Warsaw, Poland-based provider of advanced liquid cooling systems for AI and High-Performance Computing (HPC) data centers.

Liquid Cooling to Reach 53% of High-End AI Infrastructure in 2026

08/17/2026 | TrendForce
According to TrendForce’s latest AI server industry research, continued investment in AI infrastructure and the rapid iteration of AI chips from NVIDIA, AMD, and Google have pushed the TDP of individual chips above 1 kW.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

Schneider Electric Launches Uniflair XCA Chiller Line for High-Density AI Data Centers

06/09/2026 | Schneider Electric
Schneider Electric, a global energy technology leader, announced the launch of Uniflair XCA, a new series of air-cooled and free-cooling chillers designed to meet the rapidly evolving demands of AI-driven, high-density liquid-cooled data centers.
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