Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Taiwan Q1 2026 PCB Output Hits Record NT$245.6 Billion on AI Server Demand

06/23/2026 | TPCA
The Taiwan Printed Circuit Association (TPCA) and the Industrial Technology & Information Technology Institute (ISTI) released their latest Q1 2026 Taiwan PCB production and sales survey report, indicating that thanks to continued strong demand for AI servers, shipments of high-end PCB products such as substrates, high-layer-count boards (HLC), and HDI have grown. I

One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.

AT&S Joins the STOXX Europe 600

06/19/2026 | AT&S
The STOXX Europe 600 comprises 600 large-, mid-, and small-cap listed companies from 17 European countries and is regarded as a key benchmark for international investors.

Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in