-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Best Papers from SMTA International Announced
February 2, 2024 | SMTAEstimated reading time: 2 minutes
The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.
The following paper was selected for the “Best of Proceedings” award:
"A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys." Richard Coyle, Ph.D., Nokia Bell Labs, and Joint Chair of the iNEMI and HDP 3rd Generation Solder Alloy Project accepts the award on behalf of the Collaborative iNEMI and HDP Consortia Teams.
The following three papers received honorable mention in this category:
"Study of the FCBGA Package Interfaces Reliability Under Monotonic and Fatigue Loads after Sustained High Temperature" by Pradeep Lall, Ph.D., Aathi Pandurangan, Padmanava Choudhury, and Madhu Kasturi, Auburn University.
"A Path to Ductile Low Temperature Solders for Mass production of Electronic Assemblies" by Keith Sweatman, P.E., Nihon Superior; Xin Fu Tan, Qichao Hao, Stuart D. McDonald, Michael Bermingham, Kazuhiro Nogita, The University of Queensland; Qinfen Gu, ANSTO; and Tetsuro Nishimura, Nihon Superior.
"Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints." Prabjit Singh, Ph.D., IBM Corporation, and Technical Leader of the iNEMI Electromigration Project accepts the award on behalf of the iNEMI project team.
The following paper was selected for the “Best Practical and Applications-Based Knowledge” award:
"Managing Thermomechanical Behaviour in Automotive Electronics" by Maurice Dore, Valeo.
The following two papers received honorable mention in this category:
"Intermetallic Compounds in Solder Alloys: Common Misconceptions" by David Hillman, Hillman Electronic Assembly Solutions; Tim Pearson, Collins Aerospace; and Richard Coyle, Ph.D., Nokia Bell Labs.
"Performance Comparison of Contemporary Stencil Coatings and Under Wipe Solvents on 0.4mm BGA Packages" by Chrys Shea, Shea Engineering Services; Debbie Carboni, KYZEN Corporation; and John Hanerhoff, Garmin International.
The authors will receive their awards during a ceremony at SMTA International 2024. The SMTA International Conference and Exhibition (SMTAI) 2024 will be held October 21 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA. Details on participating in the 2024 SMTA International Conference are posted on the event website.
Suggested Items
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Zhen Ding Releases April 2025 Monthly Revenue Report
05/07/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2025 revenue of NT$13,589 million, up 22.90% YoY, marking a record high for the same period in the company’s history.
Schweizer Electronic AG: Business Development in Q1 of 2025
05/07/2025 | Schweizer Electronic AGThe Schweizer Group continued its growth trajectory in the first quarter of 2025. Revenue reached EUR 39.4 million in the first quarter of 2025, up 14.9% on the previous quarter (Q4 2024: EUR 34.4 million) and slightly above the level of the same quarter of the previous year (Q1 2024: EUR 39.2 million).
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.