All Flex Solutions Invests in New Flexible Circuit Facility
February 5, 2024 | All Flex SolutionsEstimated reading time: 1 minute
All Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
To date, All Flex has purchased, installed, qualified, or will qualify shortly five new manufacturing lines:
- An IPS Final Finish Line with six final finishes in one 102-foot line:
- ENIG – Electroless nickel immersion gold
- ENEPIG – Electroless nickel, electroless palladium, immersion gold
- EPIG – Electroless palladium, immersion gold
- OSP – Organic solderability preservative
- Immersion Silver
- Immersion Tin
- Pluritec Develop, Etch and Strip Line for etching copper layers and exotic materials
- CIMS Phoenix Large Format AOI
- COMAC Hot Roll Photoresist Laminator
- Pluritec Chemical Clean and Microetch Line
Kevin Jackson, All Flex Solutions CEO, commented, “this is the investment we talked about a year ago, and it signals the start of what we intend to accomplish for our customers and other stakeholders – state-of-the-art manufacturing of flexible circuits, high yields at lower costs, less handling, and an overall higher velocity manufacturing environment. We want our customers products to be built on the best equipment available for their success.”
John Fallon, All Flex Solutions President of Flexible Operations, added, “this facility and its capabilities have been years in the planning and will allow us to expand our capacity for flexible circuits, flexible heaters, and our newest product CatheterFlex® circuits – extremely long, very thin, flexible circuits for medical applications. We will add capacity and increase technology at the same time. This is a very exciting time for us!”
Suggested Items
Flexible Printed Circuit Board Market to Reach US$40.447 Billion by 2030
07/10/2025 | Globe NewswireThe flexible printed circuit board market will grow at a CAGR of 8.28% to be valued at US$40.447 billion in 2030 from US$27.17 billion in 2025.
Taiwan PCB Industry Adopts Cautious CapEx Strategy, Eyes AI and Southeast Asia for Growth
07/10/2025 | TPCADriven by the stabilization of the global electronics market and the strong demand for AI applications, although the Taiwan printed circuit (PCB) industry is facing a trend of capital expenditure convergence for three consecutive years, its output value and operating performance continue to rise, indicating that the industry is shifting from high investment to high added value development, and the industrial structure is undergoing a steady transformation.
IBIDEN Earns Recognition in FTSE Russell ESG Indexes, Reinforcing Commitment to Sustainable Growth
07/07/2025 | IBIDENIBIDEN Co, Ltd. is pleased to announce that it has been selected for FTSE4Good Index Series for the tenth consecutive year, FTSE Blossom Japan Index for the nineth consecutive year, and FTSE Blossom Japan Sector Relative Index for the fourth consecutive year.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.