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All Flex Solutions Invests in New Flexible Circuit Facility
February 5, 2024 | All Flex SolutionsEstimated reading time: 1 minute
All Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
To date, All Flex has purchased, installed, qualified, or will qualify shortly five new manufacturing lines:
- An IPS Final Finish Line with six final finishes in one 102-foot line:
- ENIG – Electroless nickel immersion gold
- ENEPIG – Electroless nickel, electroless palladium, immersion gold
- EPIG – Electroless palladium, immersion gold
- OSP – Organic solderability preservative
- Immersion Silver
- Immersion Tin
- Pluritec Develop, Etch and Strip Line for etching copper layers and exotic materials
- CIMS Phoenix Large Format AOI
- COMAC Hot Roll Photoresist Laminator
- Pluritec Chemical Clean and Microetch Line
Kevin Jackson, All Flex Solutions CEO, commented, “this is the investment we talked about a year ago, and it signals the start of what we intend to accomplish for our customers and other stakeholders – state-of-the-art manufacturing of flexible circuits, high yields at lower costs, less handling, and an overall higher velocity manufacturing environment. We want our customers products to be built on the best equipment available for their success.”
John Fallon, All Flex Solutions President of Flexible Operations, added, “this facility and its capabilities have been years in the planning and will allow us to expand our capacity for flexible circuits, flexible heaters, and our newest product CatheterFlex® circuits – extremely long, very thin, flexible circuits for medical applications. We will add capacity and increase technology at the same time. This is a very exciting time for us!”
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Brent Fischthal - Koh YoungSuggested Items
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.