-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
All Flex Solutions Invests in New Flexible Circuit Facility
February 5, 2024 | All Flex SolutionsEstimated reading time: 1 minute
All Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
To date, All Flex has purchased, installed, qualified, or will qualify shortly five new manufacturing lines:
- An IPS Final Finish Line with six final finishes in one 102-foot line:
- ENIG – Electroless nickel immersion gold
- ENEPIG – Electroless nickel, electroless palladium, immersion gold
- EPIG – Electroless palladium, immersion gold
- OSP – Organic solderability preservative
- Immersion Silver
- Immersion Tin
- Pluritec Develop, Etch and Strip Line for etching copper layers and exotic materials
- CIMS Phoenix Large Format AOI
- COMAC Hot Roll Photoresist Laminator
- Pluritec Chemical Clean and Microetch Line
Kevin Jackson, All Flex Solutions CEO, commented, “this is the investment we talked about a year ago, and it signals the start of what we intend to accomplish for our customers and other stakeholders – state-of-the-art manufacturing of flexible circuits, high yields at lower costs, less handling, and an overall higher velocity manufacturing environment. We want our customers products to be built on the best equipment available for their success.”
John Fallon, All Flex Solutions President of Flexible Operations, added, “this facility and its capabilities have been years in the planning and will allow us to expand our capacity for flexible circuits, flexible heaters, and our newest product CatheterFlex® circuits – extremely long, very thin, flexible circuits for medical applications. We will add capacity and increase technology at the same time. This is a very exciting time for us!”
Suggested Items
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
05/20/2025 | Jerome Larez -- Column: Global PCB ConnectionsIn the past decade, flex and rigid-flex PCB technology has become the fastest-growing market segment. As an increasing number of PCB companies develop the capabilities to fabricate this technology, PCB designers are becoming comfortable incorporating these designs into their products.