Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at IPC APEX 2024
February 9, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC APEX EXPO 2024 taking place April 9-11 at the Anaheim Convention Center in Anaheim, California. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
AIM’s Timothy O’Neill and Gayle Towell will also be presenting a paper titled “Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly.” This presentation will outline the current low-temperature solder landscape, unveil new research and the case for low temperature rework, and discuss use cases and the future prospects of low-temperature solder more broadly.
Timothy O'Neill is the Director of Product Management for AIM Solder. Mr. O’Neill has over 25 years of industry experience and is a Certified IPC Specialist. He is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA. Gayle Towell is AIM Solder’s Content Specialist. Holding master’s degrees in both mathematics and physics from the University of Oregon, Mrs. Towell facilitates communications, develops presentations, and ensures AIM's technical papers and documentations meet the highest scientific standards.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the IPC APEX EXPO, booth 1623 April 9-11, or visit www.aimsolder.com. To catch the presentation on low temperature solder, attend Assembly Materials Session 1 on Wednesday, April 10 from 1:30-3:00PM.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.