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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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All4-PCB Announces New Partnership with USA Microcraft
February 9, 2024 | all4-PCBEstimated reading time: Less than a minute
All4-PCB, a leading supplier of process solutions, equipment and consumables for PCB, LTCC, and CHEMICAL MILLING manufacturing industries, is excited to announce a partnership with USA Microcraft for Sales Support across North America. Microcraft is recognized for its superior range of products, which include Electrical Flying Probe Testers, Legend & Solder mask digital inkjet printers and automated TDR equipment. This collaboration aligns with all4-PCB's scope and commitment to continued world-class process solutions and will enable all4-PCB to enhance its offerings, providing customers with superior quality and the latest in PCB technology.
Suggested Items
Back to School With Jonathan Studinka
10/16/2024 | Andy Shaughnessy, Design007 MagazineAt the Anaheim Electronics & Manufacturing Show, I spoke with Jonathan Studinka, a student in John Watson’s PCB design class at Palomar College. In this interview, Jonathan shares his experience, highlighting how John’s class has broadened his understanding of PCBs and sparked his interest in mechatronics. Despite having no prior electronics training, Jonathan says he finds the coursework manageable by taking it step by step.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction
10/16/2024 | I-Connect007 Editorial TeamDesign for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost.
PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
CEE PCB Appoints Johnny Gutierrez Regional Sales Manager
10/14/2024 | CEE PCBTom Yang, CEO of CEE PCB, has announced the appointment of industry veteran Johnny Gutierrez to the position of Regional Sales Manager for North America.