The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Smart Automation: The Growing Role of Additive Manufacturing
KIC to Discuss Revolutionary Contact-less Thermal AnalysisTM at SMTA Dallas Expo and Tech Forum
February 9, 2024 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal AnalysisTM, at the SMTA Dallas Expo and Tech Forum. The event will take place on Tuesday, March 19, 2024 at the Plano Event Center.
In response to the ever-evolving challenges faced by today's manufacturing industry, KIC is proud to introduce Contact-less Thermal AnalysisTM, a revolutionary advancement in electronics manufacturing. This groundbreaking technology directly measures board temperatures during production, enabling real-time monitoring of temperature and convection changes.
KIC's Contact-less Thermal AnalysisTM is designed to redefine precision in reflow profiles by directly measuring board temperature at the end of the heated section of the reflow oven during production. This innovative capability ensures unparalleled accuracy and quality in monitoring the oven's influence on production boards, marking a monumental leap in reflow process inspection technology.
Furthermore KIC will be introducing its new profiling software platform, Thermal Analysis System, with the addition of a new recipe optimization search mode called Common Recipe FinderTM. The Thermal Analysis System software offers a state of the art User Interface, allowing complete flexibility in reflow and wave recipe setup with a “browser-like” user experience. Common Recipe FinderTM allows you to find a single recipe for multiple assemblies, streamlining your changeover time, and improving equipment utilization and OEE.
Visit KIC at the SMTA Dallas Expo & Tech Forum to engage with thermal process experts, learn more about Contact-less Thermal AnalysisTM, and explore solutions for soldering and curing processes in electronics manufacturing and semiconductor advanced packaging.
Share on:
Suggested Items
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/28/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.
Laird Thermal Systems Announces Max Kley as New CEO
04/18/2025 | Laird Thermal SystemsLaird Thermal Systems (LTS) is pleased to announce the appointment of Dr. Max Kley as its new Chief Executive Officer, effective April 1, 2025. Max Kley brings a wealth of international leadership experience to LTS, having successfully led and developed businesses across the USA, Europe, and Asia.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.