Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

GÖPEL electronic Presents Pioneering Test Solutions at Embedded World

01/27/2025 | GÖPEL electronic
From 11-13 March 2025, the embedded world Exhibition & Conference, the annual industry meeting place for the embedded community, will open its doors in Nürnberg.

Cadence to Acquire Secure-IC, a Leader in Embedded Security IP

01/22/2025 | Cadence Design Systems
Cadence announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider.

STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers

12/11/2024 | STMicroelectronics
STMicroelectronics, is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.

Accurate Circuit Engineering on Passion and Pushing the Envelope

12/03/2024 | Andy Shaughnessy, Design007 Magazine
In this interview at PCB Carolina in November, James Hofer, general manager of Accurate Circuit Engineering (ACE), shares insights into the company’s innovative approach to component embedding and highlights the passion and dedication driving his team’s commitment to quality and innovation in PCB manufacturing. James is still having fun as they push boundaries and do some pretty cool things in the process.

Siemens’ Tessent In-System Test Software Enables Advanced, Deterministic Testing Throughout the Silicon Lifecycle

11/05/2024 | Siemens
Siemens Digital Industries Software introduced Tessent™ In-System Test software, a groundbreaking design-for-test (DFT) solution that enhances in-system test capabilities for next generation integrated circuits (ICs).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in