Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
HANZA Revises Financial Targets for 2025
February 15, 2024 | HANZAEstimated reading time: 1 minute
HANZA AB revises the financial targets for 2025. The sales target is raised to SEK 6.5 billion and the 8% operating margin target is increased to apply to the full year 2025. The reason for the revision is significant organic growth, increased profitability and a completed major acquisition. Other financial targets and the dividend policy are left unchanged.
In the fall of 2022, HANZA AB prepared a strategy for the next three years called "HANZA 2025".
In brief, it is based on developing capacity and expertise in existing manufacturing clusters and services. Acquisitions that support this direction are also part of the strategy. The strategy has proven to work well and is left unchanged. However, the financial targets are adjusted as follows.
Background
A significant increase in earnings means that the group already in 2023 exceeds its previous target of "8% by the end of the financial year 2025". Furthermore, the acquisition of Orbit One has resulted in HANZA reaching pro forma sales of SEK 5.2 billion, which exceeds the previous sales target of "SEK 5 billion for the financial year 2025".
Orbit One has a lower operating margin than HANZA, which will lower the HANZA Group's margin in 2024. Furthermore, an ongoing economic slowdown affects the margin negatively. However, HANZA has good experience of integrations and already in 2024, synergies from the merger with Orbit One are expected to lead to an increased margin. Historically, HANZA's business model has proven to generate new market shares even during weaker economic periods, which is why HANZA believes that long-term organic growth will continue. Further complementary acquisitions may also be included in HANZA 2025.
Based on this, the Board of Directors has decided to raise the sales target by 30% to SEK 6.5 billion for year 2025. Additionally, the operating profit target of 8% is increased to apply to the full year 2025 for the group.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.