Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Dell Technologies, Nokia Announce Strategic Partnership to Advance Network Cloud Transformation and Private 5G
February 15, 2024 | NokiaEstimated reading time: 2 minutes
Dell Technologies and Nokia announce the extension of a strategic partnership to use each company’s expertise and industry-leading solutions, including infrastructure solutions from Dell and private wireless connectivity from Nokia, to advance open network architectures in the telecom ecosystem and private 5G use cases among businesses.
As part of the agreement, Nokia will adopt Dell as its preferred infrastructure partner for existing Nokia AirFrame customers, offering Dell’s technology as the infrastructure of choice for telecom cloud deployments. Nokia and Dell will help transition existing AirFrame customers over time to Dell’s broad infrastructure portfolio, including Dell PowerEdge servers, purpose built for modern telecom network workloads from core to edge to RAN.
The Nokia Digital Automation Cloud (NDAC) private wireless solution will become Dell’s preferred private wireless platform for enterprise customers’ edge use cases. The companies will work together to integrate Nokia’s NDAC solution with Dell NativeEdge, the edge operations software platform, to provide a comprehensive, scalable solution for enterprises.
“Through our collaboration, Nokia and Dell Technologies will harness each company’s expertise and expanded distribution to simply and quickly scale modern telecom networks and private 5G use cases,” said Dennis Hoffman, senior vice president and general manager, Telecom Systems Business, Dell Technologies. “With our decades of digital transformation experience, we’re ready to work together with Nokia’s customers to continue their network cloud transformation journey on the industry’s top selling compute platform.”
“This strategic partnership will make both companies more flexible and able to better address future customer needs. Dell’s digital transformation expertise and global scale, services and support will provide a seamless transition option for Nokia AirFrame customers, and Nokia’s vast experience in the design, deployment, and operation of high-performance public and private mobile networks will provide Dell’s customers with a comprehensive, scalable private wireless solution,” said Nishant Batra, chief strategy and technology officer, Nokia. “In line with our technology strategy, our continued collaboration with Dell will help address the future needs of our customers brought on by the increasing demands on networks and provide solutions to help communications service providers scale modern networks to the cloud.”
Building on existing research and development efforts around core network functions, the two companies will collaborate on platform and application testing and lifecycle management in the Dell Open Telecom Ecosystem Lab. Dell and Nokia plan to certify workloads on Dell Telecom Infrastructure Blocks that support Nokia Cloud offerings, while also continuing to collaborate on OEM engagements.
Share on:
Suggested Items
India’s PC Market Shipped an All-Time High of 4.49 Million Units in 3Q24
11/26/2024 | IDCIndia’s traditional PC market (inclusive of desktops, notebooks, and workstations) shipped an all-time high of 4.49 Million Units in 3Q24, up 0.1% year-over-year (YoY) according to new data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
McCauley Design Group Spreads the CAMM2 Gospel
07/30/2024 | Andy Shaughnessy, Design007 MagazineAt PCB East, I met Charlene McCauley and Terrie Duffy of the McCauley Design Group. The duo was leading a class on designing with the new CAMM2 DDR5, a JEDEC specification and standard created by Dell, which is due to replace the aging SO-DIMM in laptops. The CAMM2 (Compression Attach Memory Module) is solderless and frees up lots of real estate that SO-DIMM famously requires.
Cambridge, Intel and Dell Join Forces on UK’s Fastest AI Supercomputer
11/27/2023 | Cambridge UniversityThe Cambridge Open Zettascale Lab is hosting Dawn, the UK’s fastest artificial intelligence (AI) supercomputer, which has been built by the University of Cambridge Research Computing Services, Intel and Dell Technologies.
Dell Technologies, Denvr Dataworks to Unleash Generative AI Innovation
08/30/2023 | PRNewswireDell Technologies and Denvr Dataworks, an emerging provider of high-performance cloud infrastructure, are working together to help organizations tap the capabilities of generative AI (GenAI).
The Pulse: Rough Roughness Reasoning
07/20/2023 | Martyn Gaudion -- Column: The PulseReliable bonding reduces the risk of delamination through thermal stresses. The tried-and-tested way of achieving a good, reliable bond is to ensure that the copper is sufficiently rough to promote adhesion to the epoxy resin in the prepreg material. As materials and bonding technology improves, the copper surfaces can be made increasingly flatter and still achieve the desired reliability. In the future, new bonding methods—some already here but still on the high-priced side of the equation— may allow extremely flat copper to bond reliably. Meanwhile, as the industry is heading down the road of “smoother” copper, there is still a need to model the effects of a rough surface on signal transmission.