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Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions

04/23/2025 | PRNewswire
Ceva, Inc., the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced that Nextchip has licensed the NeuPro-M Edge AI Neural Processing Unit (NPU) IP for its next-generation advanced driver assistance systems (ADAS) solutions.

UHDI Fundamentals: UHDI Advances Neurotechnology

03/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.

Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces

02/28/2025 | PRNewswire
Neural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.

Delvitech Expands Into Microelectronics and Chiplet Segments

01/23/2025 | Delvitech
Delvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.

STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers

12/11/2024 | STMicroelectronics
STMicroelectronics, is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.
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