The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Delvitech Expands Into Microelectronics and Chiplet Segments
January 23, 2025 | DelvitechEstimated reading time: 1 minute
Delvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.
Leveraging its unparalleled adaptability, proprietary neural networks, and patented cutting-edge hardware, Delvitech is uniquely positioned to address the escalating complexities of these emerging industries.
Revolutionizing Advanced Optical Inspection
Delvitech’s groundbreaking technology has consistently set the standard in automated optical inspection (AOI) by overcoming the limitations of traditional systems. Unlike parameter- and threshold-based methods, Delvitech employs advanced AI neural networks to deliver:
- Minimal Manual Configuration, automatically identifying and configuring components with precision.
- Tailored Inspections, offering customized inspection processes tailored to specific requirements.
- Unmatched Accuracy, reducing false positives by a factor of 10 compared to industry competitors.
- Continuous Evolution, including a training manager that enhances inspection capabilities directly on the machine.
A Leap into Microelectronics and Chiplets
The company’s proprietary technology—supported by its custom-designed hardware, including a new patented optical head that will be launched in 2025—delivers the precision, flexibility, and scalability required to inspect advanced microelectronics and chiplet-based designs. As these sectors converge around complex architectures, Delvitech’s AI-powered solutions will address those critical challenges currently affecting the two sectors:
- Heterogeneous Integration: Precision inspection for multi-material assemblies and hybrid bonding.
- Nanoscale Imaging: Advanced optics capable of resolving sub-micron features.
- AI-Driven Analytics: Enhanced defect detection and classification through real-time analysis.
The Only Technology Ready for the Challenge
Delvitech’s fully integrated hardware-software ecosystem is the only solution available today capable of meeting the stringent demands of microelectronics and chiplet manufacturing. Its adaptability across production stages and ability to train neural networks on-machine ensure it remains a step ahead of evolving industry requirements.
“The microelectronics and chiplet sectors represent the forefront of technological innovation, with increasing complexity demanding unprecedented precision and adaptability,” said Roberto Gatti, CEO of Delvitech. “Our technology is uniquely positioned to provide the flexibility and performance necessary to drive these industries forward.”
A Future-Proof Solution
Delvitech’s expansion into these sectors is driven by a vision to continually push the boundaries of what is possible in inspection technology. From advanced packaging to real-time defect prevention, Delvitech is committed to delivering solutions that redefine manufacturing efficiency and reliability.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.