-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Cadence Digital, Custom/Analog Flows Certified for Latest Intel 18A Process Technology
February 22, 2024 | Cadence Design SystemsEstimated reading time: 2 minutes
Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs. Customers can now begin using the production-ready Cadence design flows and design IP to achieve design goals and speed up time to market.
“Intel Foundry is very excited to expand our partnership with Cadence to enable key markets for the leading-edge Intel 18A process technology,” said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. “We will leverage Cadence's world-class portfolio of IP, AI design technologies, and advanced packaging solutions to enable high-volume, high-performance, and power-efficient SoCs in Intel Foundry’s most advanced process technology. Cadence is an indispensable partner supporting our IDM2.0 strategy and the Intel Foundry ecosystem.”
“The Cadence R&D team collaborated with Intel Foundry to certify its flows for the Intel 18A process and EMIB advanced packaging technology, providing best-in-class SoC and Systems-of-Chips design capabilities to enable the most advanced AI, HPC and premium mobile applications,” said Nimish Modi, Senior Vice President and General Manager of Strategy and New Ventures at Cadence. “Our customers can design with confidence, knowing that we’ve optimized our tools and IP for Intel Foundry, so they are able to extract the maximum performance per watt and meet the most challenging design requirements.”
Digital Full-Flow for Intel 18A
The complete AI-driven Cadence RTL-to-GDS flow has been certified and optimized to work seamlessly with Intel 18A technology, allowing customers to meet power, performance and area (PPA) targets. The flow includes a range of robust solutions such as Cadence’s Genus™ Synthesis Solution, Innovus™ Implementation System, Quantus™ Extraction Solution, Quantus Field Solver, Tempus™ Timing Solution, Pegasus™ Verification System, Liberate™ characterization, and Voltus™ IC Power Integrity Solution.
Custom/Analog Flow for Intel 18A
Cadence Virtuoso® Studio, the integrated Spectre® Platform, and the Voltus-XFi Custom Power Integrity Solution have all been certified for Intel 18A.
Virtuoso Studio is integrated with the Innovus Implementation System, enabling a complete implementation methodology of mixed-signal designs. In addition, Virtuoso Studio delivers efficient design and layout implementation on the Intel 18A process. It has many advanced integrated features including circuit and yield optimization, reliability analysis, automatic device and standard cell place-and-route (P&R), assisted device editing capabilities (including device arrays and fill), integrated EM-IR checks, integrated signoff-quality parasitic extraction and integrated signoff-quality physical verification capabilities using Virtuoso InDesign DRC.
Design IP for Intel 18A
Cadence design IP for Intel 18A technology enables HPC and AI/ML applications, including the enterprise-class PCI Express® (PCIe®) 6.0 and Compute Express Link™ (CXL™); multi-standard PHY for LPDDR5X/5 8533Mbps to enable a diverse set of memory applications, UCIe™ to boost multi-die system in package integration and 112G extended long reach SerDes for superior bit error rate (BER) performance.
Suggested Items
CACI Awarded $290 Million Contract to Provide AI and Geospatial Expertise to NGA
12/06/2024 | CACI International Inc.CACI International Inc announced that it is an awardee of a five-year contract valued at up to $290 million to provide artificial intelligence (AI) and geospatial expertise to the National Geospatial-Intelligence Agency (NGA) under the Luno-A multi-award indefinite delivery, indefinite quantity vehicle.
Intel Announces Retirement of CEO Pat Gelsinger
12/02/2024 | BUSINESS WIREIntel Corporation announced that CEO Pat Gelsinger retired from the company after a distinguished 40-plus-year career and has stepped down from the board of directors, effective Dec. 1, 2024.
SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
11/29/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and Intel Corporation.
Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity
11/27/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on March 20, 2024, and the completion of the Department’s due diligence.
New Ultrafast Memory Boosts Intel Data Center Chips
11/19/2024 | IntelWhile Intel’s primary product focus is on the processors, or brains, that make computers work, system memory (that’s DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen).