Defense Speak Interpreted: Weapons—Electrical Power vs. Energetics
The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
American Made Advocacy: National Security and Industrial Policy Inextricably Linked
ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event
February 27, 2024 | ASC SunstoneEstimated reading time: 1 minute
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.
Scheduled to take place on March 26th, the event will feature presentations from renowned experts in the field which will include John Johnson from ASC Sunstone. Topics will cover advances in UHDI design, manufacturing processes, material innovations, and reliability considerations.
As a company committed to innovation and excellence in PCB manufacturing, ASC Sunstone recognizes the importance of supporting events like this that promote industry advancement and facilitate meaningful dialogue among peers.
"We are thrilled to sponsor the SMTA UHDI event," said Anaya Vardya, CEO of ASC Sunstone. "Innovation in ultra high-density interconnects is driving significant changes in the electronics industry, and we are proud to be at the forefront of this evolution. This event provides an invaluable opportunity for professionals to come together, share insights, and collaborate on shaping the future of UHDI technology."
The event will take place at Peoria Sports Complex in Peoria, AZ, and registration is open to professionals from across the electronics manufacturing industry. Attendees can register for the event on the SMTA website at smta.org/mpage/uhdi.
Educational titles from American Standard Circuits:
- Podcast: On the Line with...ASC Sunstone, Designing for Reality
- The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
Visit I-007eBooks.com to download these and other free titles.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Pan-European Electronics Design Conference Returns Better Than Ever
12/11/2025 | I-Connect007 Editorial TeamFollowing a highly successful inaugural event, the Pan-European Electronics Design Conference (PEDC) returns, this time to Prague, Czech Republic, Jan. 21–22, 2026. In this Q&A, Peter Tranitz, the Global Electronics Association’s senior director of technology solutions, shares the value of attending PEDC, which aims to bring together PCB designers from across Europe to learn, network, and share their own knowledge.
Technica Showcases Partners and Announces TECH DAYS at Silicon Valley SMTA Expo & Tech Forum
12/05/2025 | Technica USATechnica Corporation participated in this week’s Silicon Valley SMTA Expo & Tech Forum, joined by many of the company’s leading PCB assembly supply partners.
AT&S Hinterberg Charity Run Raises €5,200 for the Ö3 Christmas Miracle
12/04/2025 | AT&SAT&S and SV Hinterberg joined forces for the organization, supported by committed partners such as the Montanuniversität Leoben, RHI Magnesita and the LE-Laufevent club.
GPV Hosts Let’s Talk 2025 to Navigate Global Markets
12/01/2025 | GPVThe event was dedicated to strengthening partnerships and sharing insights about where the EMS industry is heading. This year’s theme, “Navigating Global Markets”, brought together more than 300 industry participants for discussions on uncertainty, competitiveness, and the opportunities ahead.
Real Time with... SMTAI 2025: Advancing PCB Manufacturing with Laser Depaneling from LPKF
11/12/2025 | Real Time with...SMTAIMarcy LaRont and Jake Benz of LPKF discuss the growing interest in laser depaneling technology. Jake introduces the CuttingMaster 2246, a high-power laser that enhances the processing of FR4 substrates.