FEATURED NEWS AND INFORMATION:
We search high and low to find the best news for you, our valuable readers…
Flexible Printed Circuit Boards Market Expected to Reach $51.05 Billion by 2031 at a CAGR of 11.2%
A new report by Coherent Market Insights forecasts the global flexible printed circuit boards (FPCB) market to reach $51.05 billion by 2031,...
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone...
Merlin Circuit Technology Enhances Solder Mask Coating Technology (LPI)
Merlin Circuit Technology has invested in the latest LPI coating system installing the AHK Atomizer. The AHK spray coating system delivers enhanced...
Growth Unfolds: The First of STARTEAM’s Trio of Factories Set to Expand
STARTEAM is thrilled to share news of our upcoming 3-step expansion at JST, with each step adding 50,000m² per month which began on May 27, 2024....
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
FEATURED ARTICLES AND COLUMNS:
MORE ARTICLES
Merry Christmas from I-Connect007!
December 25, 2024 | Marcy LaRont, I-Connect007
Though a modern Christmas typically brings to mind vivid images of a jolly Santa Clause, excited children opening gifts on Christmas morning, and huge feasts on festive looking holiday tables, the great holidays in every culture and religious tradition comes with an interesting historical context.
Sayonara to the Last Standing Copper Foil Plant in North America
December 17, 2024 | Marcy LaRont, I-Connect007
In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
MORE ARTICLES
Advanced Packaging and Stackup Design Featuring:
- Effects of Advanced Packaging on Stackup Design, with Kris Moyer
- Are Our Rules No Longer Valid? by Cherie Litson
- AI-driven Inverse Stackup Optimization, by Barry Olney
- Advanced Packaging Technologies: Look Before You Leap, by Kelly Dack
- Advanced Semiconductor Packaging Impact on PCB Stackup, by Vern Solberg
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in