Lorena Villanueva highlights IPC Mexico's three-year journey focused on community building and partnerships with governments and educational institutions. Key milestones include collaboration agreements with state governments and universities to enhance the electronics industry. IPC Days promotes networking and education, while a partnership with UNAM aims to integrate IPC training into engineering programs. The discussion wraps up with congratulations on IPC Mexico's achievements and the launch of the Mexico pavilion at this year's show.

High density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.

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