Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
SMTA Ultra High-Density Interconnect Symposium Is Nearly Here
February 27, 2024 | SMTAEstimated reading time: 2 minutes
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology. As feature sizes continue their relentless journey towards miniaturization, this symposium will provide insight into the rapidly evolving landscape of Ultra HDI: PCB Design, Fabrication, Assembly, and Reliability. Topics will include:
- Bridging the gap between OEM demands and Ultra HDI innovation
- Materials that redefine Ultra HDI possibilities
- Paradigm-shifting PCB fabrication techniques
- Assembly success: overcoming challenges in shrinking feature sizes
- Design strategies that address both complexity and performance
- Ensuring reliability in Ultra HDI solutions
- Interplay between Ultra HDI and the burgeoning semiconductor landscape
From our presenters and sponsors –
“Celebrating the convergence of advanced technology and miniaturization, the SMTA UHDI Symposium offers a window into the future of PCBs. With UHDI technology at its core, this event illuminates the path toward smaller yet more powerful electronic component. … Joining industry pioneers at this conference isn't just about staying informed – it’s an opportunity to immerse yourself in the latest advancements with industry experts, connect with peers, and be at the forefront of innovation. – PRESENTER, Jan Pedersen, NCAB Group
“In my opinion, ultra HDI manufacturing is a game-changer for PCB fabricators in North America, enabling the production of highly complex and densely populated boards that meet the demands of advanced applications. … By embracing even select UHDI processing techniques, which will be highlighted in this year’s SMTA UHDI Symposium, PCB fabricators can differentiate themselves and deliver cutting-edge solutions that drive growth and success in the industry." – PRESENTER, Raanan Novik, KLA
"Peoria is thrilled to showcase its momentum in the semiconductor sector through the prestigious SMTA Global Conference," said Jennifer Stein, Director of Economic Development. "The recent addition of Amkor to our city underscores our commitment to fostering innovation and creating opportunities for growth in advanced manufacturing and related industries. Our infrastructure, great year-round climate, and access to specialized talent make Peoria a great location for businesses to expand or relocate.”
Thought leaders and experts from across a broad spectrum are invited to attend and contribute to the discussion and to help accelerate the development and implementation of this important technology and ultimately, shorten the time to move from the prototyping phase of process and product development to a proven process in the high mix, low volume manufacturing environment.
The SMTA Ultra-HDI conference will be held on March 26th, 2024 at the Peoria Sports Complex at 16101 N. 83rd Ave., Peoria, AZ. Registration is now open at SMTA.org.
Share on:
Suggested Items
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/07/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?
Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
Standard of Excellence: The Power of Personalization in Customer Care
02/19/2025 | Anaya Vardya -- Column: Standard of ExcellenceProviding outstanding customer care is essential, yet many companies struggle to deliver service that leaves a lasting, positive impression. The secret lies in personalization. When you tailor your services to meet the unique needs of your customers, you win their loyalty and position yourself as a partner in their success. Here’s how personalization can transform your customer care strategy and elevate your business.
Calumet Electronics Expands Domestic Manufacturing with Capital Investments
02/12/2025 | Calumet ElectronicsCalumet Electronics Corporation, one of America’s most reliable and innovative printed circuit board suppliers, is committed to advancing technologies that are critical to the nation’s aerospace, defense, and commercial markets. In support of that mission, the company is making significant capital investments in equipment to produce high-reliability, high-density interconnect (HDI) printed circuit boards.