SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Learning with Leo: Why Risk-based Auditing Is Reshaping Cable Assembly Quality
Nolan’s Notes: Wire Harness—The Underdog of the Industry
SMTA Ultra High-Density Interconnect Symposium Is Nearly Here
February 27, 2024 | SMTAEstimated reading time: 2 minutes
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology. As feature sizes continue their relentless journey towards miniaturization, this symposium will provide insight into the rapidly evolving landscape of Ultra HDI: PCB Design, Fabrication, Assembly, and Reliability. Topics will include:
- Bridging the gap between OEM demands and Ultra HDI innovation
- Materials that redefine Ultra HDI possibilities
- Paradigm-shifting PCB fabrication techniques
- Assembly success: overcoming challenges in shrinking feature sizes
- Design strategies that address both complexity and performance
- Ensuring reliability in Ultra HDI solutions
- Interplay between Ultra HDI and the burgeoning semiconductor landscape
From our presenters and sponsors –
“Celebrating the convergence of advanced technology and miniaturization, the SMTA UHDI Symposium offers a window into the future of PCBs. With UHDI technology at its core, this event illuminates the path toward smaller yet more powerful electronic component. … Joining industry pioneers at this conference isn't just about staying informed – it’s an opportunity to immerse yourself in the latest advancements with industry experts, connect with peers, and be at the forefront of innovation. – PRESENTER, Jan Pedersen, NCAB Group
“In my opinion, ultra HDI manufacturing is a game-changer for PCB fabricators in North America, enabling the production of highly complex and densely populated boards that meet the demands of advanced applications. … By embracing even select UHDI processing techniques, which will be highlighted in this year’s SMTA UHDI Symposium, PCB fabricators can differentiate themselves and deliver cutting-edge solutions that drive growth and success in the industry." – PRESENTER, Raanan Novik, KLA
"Peoria is thrilled to showcase its momentum in the semiconductor sector through the prestigious SMTA Global Conference," said Jennifer Stein, Director of Economic Development. "The recent addition of Amkor to our city underscores our commitment to fostering innovation and creating opportunities for growth in advanced manufacturing and related industries. Our infrastructure, great year-round climate, and access to specialized talent make Peoria a great location for businesses to expand or relocate.”
Thought leaders and experts from across a broad spectrum are invited to attend and contribute to the discussion and to help accelerate the development and implementation of this important technology and ultimately, shorten the time to move from the prototyping phase of process and product development to a proven process in the high mix, low volume manufacturing environment.
The SMTA Ultra-HDI conference will be held on March 26th, 2024 at the Peoria Sports Complex at 16101 N. 83rd Ave., Peoria, AZ. Registration is now open at SMTA.org.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AdvancedPCB Strengthens HDI Process Control with New AOI Investment in Chandler, AZ Facility
03/23/2026 | AdvancedPCBAdvancedPCB has expanded its high-density interconnect (HDI) quality inspection capabilities with the installation of the CIMS Phoenix MDI AOI system in its Chandler, Arizona facility, enabling precision inspection of mechanical drills down to 150 µm in diameter.
SMTA Announces Program for 2026 Ultra High Density Interconnect (UHDI) Symposium
03/20/2026 | SMTAThe SMTA is excited to announce the technical program for the 3rd annual Ultra High Density Interconnect Symposium which takes place on April 9, 2026 in Avondale, Arizona, USA.
Sustainability Takes Center Stage in ‘On the Line With… Isola’ Podcast, Episode 3
03/25/2026 | I-Connect007I-Connect007 announces the release of Episode 3 of the podcast series On the Line With…, titled “The Green Circuit—Sustainability in PCB Manufacturing.” In this installment of PCB Materials: The Backbone and Future of Electronics, host Marcy LaRont speaks with Isola CTO Kirk Thompson about the growing role sustainability is playing in shaping the next generation of PCB materials and manufacturing processes.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.