Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Real Time with... IPC APEX EXPO 2024: Exploring Silicone Solutions with R&D Director of CHT

04/17/2024 | Real Time with...IPC APEX EXPO
In this interview, Gerry Ellis, the R&D director for CHT, discusses the product range offered by his company. He explains the challenges in creating base formulations, the drive to make products more user-friendly, and the various application techniques involved. Ellis also highlights the key market segments and the significance of providing efficient solutions to customers.

SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1

04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.

Phil Kinner Pushes His Limits in Engineering and Running

04/17/2024 | Linda Stepanich, IPC
Engineers break things on purpose. They like the challenge of putting things back together and making them stronger and more resilient. The skills engineers use to build products can also be used to rebuild their lives after a personal loss, something Phil Kinner learned when he laced up his running shoes after many years of a sedentary lifestyle.

Catching Up With Chasom Electronics

04/16/2024 | Dan Beaulieu, D.B. Management Group
I recently met with Chasom Electronics’ founding director Anil Kumar. Chasom offers a unique menu of services for companies looking to extend their technology capabilities on a short- or long-term basis. Read on to learn about this very unique service company.

Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science

04/16/2024 | BUSINESS WIRE
Leaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in