-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 3
March 1, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Chapter 3: Thermal Resistance/Impedance and Measurement
Note that several measurement methods are in common use and typically produce different results. Obviously, this can cause confusion. The Rth value of a thermal resistance, or its thermal conductivity, is meaningless if the test method is not specified.
Following is a brief review of the different measurement methods:
ASTM E1461
The image on the left in Figure 3.1 shows the experimental setup and measurement principle for the test method ASTM E1461 (Standard Test Method for Thermal Diffusivity by the Flash Method). This is a contactless test method for high-temperature testing using a laser. One surface of the test sample is irradiated with a flash of the laser and the thermal transfer to the other side is measured using an infrared detector.
A test sample measured according to ASTM E1461 was shown to have thermal conductivity of 3.3 W/mK.
ISO 22007-2
The center diagram in Figure 3.1 describes the test setup and measurement principle for testing according to the ISO 22007-2 transient plane heat source (hot disc) method. This method allows fast testing and high accuracy, eliminating opportunities for measurement failures and yielding a value without transfer losses. The test sample needs to be at least 3 mm thick.
Using this setup to test the same sample as in the previous ASTM E1461 test showed the thermal conductivity to be 5 W/mK.
ASTM D5470
The diagram on the right in Figure 3.1 describes the test method ASTM D5470. A heat flow is set up through the sample, establishing a temperature gradient that is measured in the steady state. The thermal conductivity/resistance of the sample is then calculated using a method described in the standard.
Suggested Items
CIMS to Exhibit at JPCA Show 2025
05/28/2025 | CIMSCIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
Rohde & Schwarz Satellite Industry Day 2025: Connecting the World with New Space and 5G NTN Technologies
05/27/2025 | Rohde & SchwarzAfter four successful online events with over 1000 participants, Rohde & Schwarz is hosting its fifth Satellite Industry Day on June 3, 2025, on-site at its Munich campus. Rohde & Schwarz test and measurement experts and partners from the industry will present topics from 5G Non-Terresterial Network (NTN) and satellite testing to monitoring and regulatory issues. During breaks participants can experience cutting-edge test and measurement solutions.
Vertical Aerospace Makes Aviation History with Piloted eVTOL Flight in Open Airspace
05/27/2025 | BUSINESS WIREVertical Aerospace, a global aerospace and technology company that is pioneering electric aviation, announced it has made European aviation history with the first-ever piloted wingborne flight of a winged electric vertical take-off and landing (eVTOL) aircraft in open airspace.
TRI, Bosch Partner on AI Solution for MEMS Packaging
05/26/2025 | TRITest Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.
QinetiQ’s LTPA Extension Worth £1.54B to Modernize Test & Evaluation for Future Warfare
05/26/2025 | QinetiQQinetiQ Group plcannounces a five-year, £1.54 billion extension to its Long Term Partnering Agreement (LTPA) with the UK’s Ministry of Defence (MOD) that will transform the provision of mission critical test and evaluation capabilities and services that help to enhance operational readiness of the UK and allied nations.