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Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
March 5, 2024 | MatrixEstimated reading time: 2 minutes
Matrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
Matrix USA will be exhibiting its full line of advanced materials and process equipment to support the North American printed circuit board market. Key products include:
PANASONIC MEGTRON FAMILY OF HIGH-SPEED LOW-LOSS PCB MATERIALS – The global industry standard for High Speed, Low Loss Multi-layer circuit board materials suitable for large capacity and high-speed transmission of high frequency signal for high-end ICT infrastructure equipment, automotive industry and other applications Featuring the new Megtron 8 laminate and prepreg along with the availability of Buried Resistor Copper Foil for special applications.
PANASONIC FELIOS – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial, and medical markets. Featuring Felios R-F705S and R-BM17 low loss LCP flexible laminates and bond adhesives to support the growing 5G and medical markets.
ADVANCED COPPER FOIL – Featuring new arsenic free copper foils from Circuit Foil to support growing global requirements and the ACF2 and ACF3 aluminum supported ultra-thin and HVLP copper foils for the latest multilayer and UHDI designs.
PERFECT POINT PRECISION DRILL TOOLS – Featuring the new patented Carbonite specialty coated hybrid single flute drill especially designed for ultra-high tech PCB designs.
PETERS SOLDERMASK – Peters is a leading global manufacturer of coating materials for electronics. Peters’ expansive high-tech product lines are used in PCB solder mask, plugging, marking inks and assembly of PCBs for sectors for high tech, high reliability markets. As an R&D leader in this segment Peters was the first to provide SVHC free LPISM, first to offer a true white non-yellowing solder mask and has now become a leading player in the development of inkjet solder masks.
KINGBOARD LAMINATES – Kingboard is a vertically integrated company specializing in the manufacture of PCB laminates, prepreg and copper foil. Since establishing its first plant in 1988 Kingboard has quickly grown to be the largest manufacturer of copper clad laminate and prepreg. Kingboard’s FR4 materials have achieved global recognition for technical performance and value in key high technical and reliability markets.
HAKUTO AND ADVANCED ENGINERING EQUIPMENT – Matrix will be highlighting new advanced equipment and process automation from Hakuto and Advanced Engineering to support UHDI and IC substrate manufacturing.
IRON MOUNTAIN™ – A trusted source for PCB registration tools. Introducing Iron Mountain, a new name backed by over 40 years of proven industry PCB registration performance and leadership in the lamination tooling industry. Iron Mountain is in Washington State, USA and all products and technology are proudly made in the USA.
Matrix and Panasonic personnel will be available at Booth 4245 to discuss the features, benefits, and advantages of these circuit board materials, equipment, and value-added services.
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RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
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IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.