-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
March 5, 2024 | MatrixEstimated reading time: 2 minutes
Matrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
Matrix USA will be exhibiting its full line of advanced materials and process equipment to support the North American printed circuit board market. Key products include:
PANASONIC MEGTRON FAMILY OF HIGH-SPEED LOW-LOSS PCB MATERIALS – The global industry standard for High Speed, Low Loss Multi-layer circuit board materials suitable for large capacity and high-speed transmission of high frequency signal for high-end ICT infrastructure equipment, automotive industry and other applications Featuring the new Megtron 8 laminate and prepreg along with the availability of Buried Resistor Copper Foil for special applications.
PANASONIC FELIOS – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial, and medical markets. Featuring Felios R-F705S and R-BM17 low loss LCP flexible laminates and bond adhesives to support the growing 5G and medical markets.
ADVANCED COPPER FOIL – Featuring new arsenic free copper foils from Circuit Foil to support growing global requirements and the ACF2 and ACF3 aluminum supported ultra-thin and HVLP copper foils for the latest multilayer and UHDI designs.
PERFECT POINT PRECISION DRILL TOOLS – Featuring the new patented Carbonite specialty coated hybrid single flute drill especially designed for ultra-high tech PCB designs.
PETERS SOLDERMASK – Peters is a leading global manufacturer of coating materials for electronics. Peters’ expansive high-tech product lines are used in PCB solder mask, plugging, marking inks and assembly of PCBs for sectors for high tech, high reliability markets. As an R&D leader in this segment Peters was the first to provide SVHC free LPISM, first to offer a true white non-yellowing solder mask and has now become a leading player in the development of inkjet solder masks.
KINGBOARD LAMINATES – Kingboard is a vertically integrated company specializing in the manufacture of PCB laminates, prepreg and copper foil. Since establishing its first plant in 1988 Kingboard has quickly grown to be the largest manufacturer of copper clad laminate and prepreg. Kingboard’s FR4 materials have achieved global recognition for technical performance and value in key high technical and reliability markets.
HAKUTO AND ADVANCED ENGINERING EQUIPMENT – Matrix will be highlighting new advanced equipment and process automation from Hakuto and Advanced Engineering to support UHDI and IC substrate manufacturing.
IRON MOUNTAIN™ – A trusted source for PCB registration tools. Introducing Iron Mountain, a new name backed by over 40 years of proven industry PCB registration performance and leadership in the lamination tooling industry. Iron Mountain is in Washington State, USA and all products and technology are proudly made in the USA.
Matrix and Panasonic personnel will be available at Booth 4245 to discuss the features, benefits, and advantages of these circuit board materials, equipment, and value-added services.
Suggested Items
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.
Beyond Design: Electro-optical Circuit Boards
01/22/2025 | Barry Olney -- Column: Beyond DesignPredicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.