Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
March 5, 2024 | MatrixEstimated reading time: 2 minutes
Matrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
Matrix USA will be exhibiting its full line of advanced materials and process equipment to support the North American printed circuit board market. Key products include:
PANASONIC MEGTRON FAMILY OF HIGH-SPEED LOW-LOSS PCB MATERIALS – The global industry standard for High Speed, Low Loss Multi-layer circuit board materials suitable for large capacity and high-speed transmission of high frequency signal for high-end ICT infrastructure equipment, automotive industry and other applications Featuring the new Megtron 8 laminate and prepreg along with the availability of Buried Resistor Copper Foil for special applications.
PANASONIC FELIOS – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial, and medical markets. Featuring Felios R-F705S and R-BM17 low loss LCP flexible laminates and bond adhesives to support the growing 5G and medical markets.
ADVANCED COPPER FOIL – Featuring new arsenic free copper foils from Circuit Foil to support growing global requirements and the ACF2 and ACF3 aluminum supported ultra-thin and HVLP copper foils for the latest multilayer and UHDI designs.
PERFECT POINT PRECISION DRILL TOOLS – Featuring the new patented Carbonite specialty coated hybrid single flute drill especially designed for ultra-high tech PCB designs.
PETERS SOLDERMASK – Peters is a leading global manufacturer of coating materials for electronics. Peters’ expansive high-tech product lines are used in PCB solder mask, plugging, marking inks and assembly of PCBs for sectors for high tech, high reliability markets. As an R&D leader in this segment Peters was the first to provide SVHC free LPISM, first to offer a true white non-yellowing solder mask and has now become a leading player in the development of inkjet solder masks.
KINGBOARD LAMINATES – Kingboard is a vertically integrated company specializing in the manufacture of PCB laminates, prepreg and copper foil. Since establishing its first plant in 1988 Kingboard has quickly grown to be the largest manufacturer of copper clad laminate and prepreg. Kingboard’s FR4 materials have achieved global recognition for technical performance and value in key high technical and reliability markets.
HAKUTO AND ADVANCED ENGINERING EQUIPMENT – Matrix will be highlighting new advanced equipment and process automation from Hakuto and Advanced Engineering to support UHDI and IC substrate manufacturing.
IRON MOUNTAIN™ – A trusted source for PCB registration tools. Introducing Iron Mountain, a new name backed by over 40 years of proven industry PCB registration performance and leadership in the lamination tooling industry. Iron Mountain is in Washington State, USA and all products and technology are proudly made in the USA.
Matrix and Panasonic personnel will be available at Booth 4245 to discuss the features, benefits, and advantages of these circuit board materials, equipment, and value-added services.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.