It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
IPC APEX EXPO 2024 Technical Conference: Innovation Communication
March 6, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
IPC APEX EXPO continues to build upon a long tradition of technical program depth. In recent years, the technical program staff has fostered an increased depth of research in the technical program and expanded the scope and variety of the special sessions.
Of particular interest to EMS-oriented attendees is the Factory of the Future technical track, which is comprised of three separate sessions and 10 presentations. These two-hour sessions take place Tuesday, April 9, and Wednesday, April 10, and range in topics that include artificial intelligence, machine learning, digital twin, automation, and additive manufacturing.
To illustrate what attendees can expect from the technical sessions, we reached out to the presenters in the Factory of the Future sessions and invited them to share a little about the topic of their presentation. The following four presenters responded with a summary of their presentations.
In addition to the increased technical depth in IPC APEX EXPO technical programs, IPC has expanded the Special Conference Sessions. This year, special sessions will explore EV electronics, moderated by MacDermid Alpha Electronics Solutions’ Lenora Clark, and advanced packaging, led by IPC CTO Matt Kelly. These sessions take place sequentially on Thursday, April 11.
“Liquid Metal Patterning for Electronics”
Presenter: Michael Dickey, NC State University
This talk will explore the fascinating and unique properties of liquid metals based on gallium. These metals are liquids at room temperature and can be patterned into useful shapes to create soft and stretchable electronic devices.
Related video:
Continue reading the rest of this article in the March 2024 issue of SMT007 Magazine.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Technica Announces Tech Day Event Dates and Agenda
04/13/2026 | Technica USATechnica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
BTU Appoints Performance Technologies Group as Exclusive Representative in Tri-State Region
04/08/2026 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced that Performance Technologies Group, Inc. (PTG) has been appointed as its exclusive manufacturers’ representative for New York, New Jersey, and eastern Pennsylvania, effective March 20, 2026.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
Leonard Polte Named Solder Chemistry Field Sales Manager
04/02/2026 | Solder ChemistrySolder Chemistry, a leading innovator in industrial material solutions, announced the appointment of Leonard Polte as Field Sales Manager.