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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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TopLine, TANAKA to Co-exhibit at IPC APEX 2024
March 6, 2024 | TopLineEstimated reading time: Less than a minute

TopLine Corporation will co-exhibit in booth #1231 with Tanaka Precious Metals at the upcoming IPC APEX 2024 conference and exhibition at the Anaheim Convention Center, Anaheim, California, April 9 – 11. At IPC Apex, At IPC Apex, TopLine will display CCGA, BGA, daisy chain test components as well as bonding wire by Tanaka Precious Metals.
IPC APEX EXPO 2024 is the electronics manufacturing industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference, professional development courses taught by industry experts, non-stop networking and more, in Anaheim, California, April 6-11, 2024, where IPC APEX EXPO hosts the Electronic Circuits World Convention 16 (ECWC16).
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