Nepes Expands IC Packaging Capabilities for the 3D-IC era with Advanced Design Flows from Siemens
March 8, 2024 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D-IC packages.
“nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” said Brad Seo, vice president of SAPEON Korea’s R&D center. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for advanced packaging, we also can achieve the innovative technologies necessary to grow.”
nepes has an established track record of providing customers with world-class packaging, testing, and semiconductor assembly services for clients throughout the global electronics industry. nepes also offers packaging design services including wafer level packaging, fan-out wafer level packages, and panel level packaging.
Building on this foundation, nepes is now driving additional packaging innovation with a broad range of advanced technologies from Siemens EDA, including the Calibre® nmPlatform, which includes Calibre® 3DSTACK software, HyperLynx™ software for electrical rule checking, as well as Siemens’ industry-leading Xpedition™ Substrate Integrator software and Xpedition™ Package Designer software. Together, these Siemens technologies helped nepes provide fast and reliable design services including 2.5D/3D-based chiplet designs for the company’s growing base of global IC customers.
“Siemens is committed to delivering industry-leading semiconductor packaging technologies to supply chain partners such as nepes, which helps enable them to achieve their digitalization goals,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “As an existing partner and supplier to nepes we are pleased to extend this relationship for the advantage of our mutual customers.”
Suggested Items
AI to Boost Wafer Foundry Market by 20%
09/19/2024 | TrendForceTrendForce posits that the wafer foundry market is expected to see a recovery in 2025, with an estimated annual growth of 20%—up from 16% in 2024.
Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design
09/18/2024 | John Watson -- Column: Elementary, Mr. WatsonImagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
From Silicon to Systems
09/10/2024 | Andy Shaughnessy, Design007 MagazineFor the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.
CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
08/29/2024 | TrendForceTrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025.