Nepes Expands IC Packaging Capabilities for the 3D-IC era with Advanced Design Flows from Siemens
March 8, 2024 | SiemensEstimated reading time: 1 minute

Siemens Digital Industries Software announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D-IC packages.
“nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” said Brad Seo, vice president of SAPEON Korea’s R&D center. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for advanced packaging, we also can achieve the innovative technologies necessary to grow.”
nepes has an established track record of providing customers with world-class packaging, testing, and semiconductor assembly services for clients throughout the global electronics industry. nepes also offers packaging design services including wafer level packaging, fan-out wafer level packages, and panel level packaging.
Building on this foundation, nepes is now driving additional packaging innovation with a broad range of advanced technologies from Siemens EDA, including the Calibre® nmPlatform, which includes Calibre® 3DSTACK software, HyperLynx™ software for electrical rule checking, as well as Siemens’ industry-leading Xpedition™ Substrate Integrator software and Xpedition™ Package Designer software. Together, these Siemens technologies helped nepes provide fast and reliable design services including 2.5D/3D-based chiplet designs for the company’s growing base of global IC customers.
“Siemens is committed to delivering industry-leading semiconductor packaging technologies to supply chain partners such as nepes, which helps enable them to achieve their digitalization goals,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “As an existing partner and supplier to nepes we are pleased to extend this relationship for the advantage of our mutual customers.”
Suggested Items
IDC: Semiconductor Foundry 2.0 Market is Entering the Growth Phase from Recovery with 11% YoY Growth in 2025
03/24/2025 | IDCAccording to IDC ’s Worldwide Semiconductor Supply Chain Tracking Intelligence latest report, the global semiconductor market, following a recovery in 2024, is expected to experience steady growth in 2025.
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
03/24/2025 | ZukenZuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/07/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
03/05/2025 | Marcy LaRont, I-Connect007It was a cool and sunny morning as I headed out to the IMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. IMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.