-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Essemtec Exhibiting at IPC APEX Expo at Booth 2409
March 12, 2024 | EssemtecEstimated reading time: 2 minutes

We are showcasing our flagship All-in-One platforms FOX and PUMA. The machines will be equipped with the latest innovations in Solder Jetting, Integrated Inspection System, Smart Material Management, and 4 mm EVO feeder – 08004 Pick-and-Place.
The All-in-One platform will demonstrate live the highest standards in electronics assembly on flexible substrates, jetting of multiple fluids three times faster and efficient rework on populated boards.
Essemtec presents its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a comprehensive range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam, and Underfill.
Our in-house rapid prototyping solution will be demonstrated on Nano Dimension’s DragonFly 3D printer and Essemtec FOX equipment with the combined dispensing and components placement capabilities. This is a revolutionary end-to-end concept that accelerates the assembly process, protects IP, and creates supplementary internal synergy.
Under the motto “Our Focus - Your Solution,” we focus on proven new solutions in various segments for electronics production, as NPI, High-Mix/Low-Volume, High-Speed Dispensing, Printed Electronics, and Complex Repair.
High-Speed Solder Paste Jetting - for all product platforms
Essemtec is dedicated to continuous improvement. An increased solder jet speed of 180’000 – 400’000 dots/h can be achieved. It is now possible, with the new increased speed and accuracy, to exchange inflexible traditional solder paste screen printers with a P&P integrated solder paste jetting solution to serve multiple machines in a highly flexible line solution. End users gain the flexibility to solder jet products & place components in the All-in-One Systems or dedicated high-speed dispensers for volume production, integrating the system for process improvement capability.
Integrated Inspection System – for all product platforms
First time in the industry an Integrated Inspection System (I2S) in the Pick and Place and dispensing solutions will be shown. The Integrated Inspection System is available for dispensed and jetted material as well as placed SMD components right after the process. Thus, only good, inspected products are entering the reflow ovens. The process also includes an automated repair function.
The system is already integrated in automotive and complex production sites by various companies.
Smart Material Management - integrated solution for factory 4.0
The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage locations. The solution enables right material placement at the right time. The traceability is precise down to individual component.
The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage location to fully automated storage cabinets. Smart Material Management The solution offers high ROI and is fully integrated with the production machine and the ERP systems.
Our team of engineers will share best tips for the hottest SMT topics on the market to help you improve the time to market, increase the flexibility of your production line and optimize your manufacturing costs.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.