DARPA Explores Additive Manufacturing’s Revolutionary Potential for Futuristic Microsystems
March 12, 2024 | DARPAEstimated reading time: 2 minutes
DARPA played a seminal role in establishing materials science as a discipline. One of the latest disruptive efforts in new materials and applications, the Additive Manufacturing of Microelectronic systEms (AMME) program, seeks to launch microsystems manufacturing far beyond today’s state of the art.
AMME takes aim at revolutionizing the manufacture of microsystems through technological breakthroughs in producing novel, multi-material microsystems at incredible speeds, volumes, and resolution. This additive manufacturing process would enhance commercial devices with innovative add-on technologies and create the ability to rapidly respond to mission requirements – innovations similar to additive manufacturing’s transformation of complex prototyping. With AMME, DARPA aims to overcome fundamental limits specifically for microsystems.
DARPA seeks groundbreaking advances in additive manufacturing by achieving a trifecta of material quality, high resolution, and massive print throughput. The goal of AMME will be to make it possible to create microsystems with new geometries that would be able to integrate mechanical, electrical, or biological subcomponents.
“AMME is inspired by new insights from selective material synthesis and volumetric additive manufacturing that would enable a new class of microsystems,” said Michael Sangillo, AMME program manager. “We want to remove design rules imposed by traditional manufacturing tools and demonstrate novel microsystem technologies that create new opportunities for national security and emerging applications.”
Today’s methods are hamstrung by the inherent tradeoffs between resolution and throughput of traditional manufacturing: such as precise 3D printing that may be ultra-high resolution but subject to low throughput, or volumetric printing that’s high throughput but limited to lower resolution and one material at a time. AMME researchers will work to simultaneously synthesize high-quality multi-materials at unprecedented resolution levels and throughputs.
This will require AMME performers to invent radically new approaches for 3D additive manufacturing of complex geometric microsystems. This includes creating precursor material combinations that allow for rapid, multi-material printing that is not possible today. An additional challenge will be creating a fabrication process capable of printing at sub-micron resolution and extremely fast speeds. If successful, AMME will print a penny-sized microsystem (with 500 nm resolution) in about three minutes.
“Our objective is to demonstrate a novel, functional microsystem that achieves additive manufacturing advances not possible today – advances like the ability for astronauts to make on-demand repairs in space,” Sangillo said. “AMME will also focus on the commercialization approach, so we can produce a manufacturing system that can be quickly adopted by the broader industrial community, including DOD and other U.S. government organizations.”
Suggested Items
Bell Announces New Manufacturing Facility for the U.S. Army’s Future Long Range Assault Aircraft
12/18/2024 | BellBell Textron Inc., a Textron Inc. company, announced a facility site selection today to support production of the U.S. Army’s Future Long Range Assault Aircraft (FLRAA). The new 447,000 sq. ft. factory, located in the Denton County region of Fort Worth, Texas, will be dedicated to FLRAA component manufacturing. Bell plans to begin facility modification and equipment installation and achieve facility readiness for Low-Rate Initial Production (LRIP) by 2028.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
12/18/2024 | SEMISEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry. Themed
ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
12/18/2024 | ViTroxViTrox Technologies, which aims to be the World’s Most Trusted Technology Company in delivering innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics manufacturing industries, is honoured to announce its partnership with Gemaddis as its new Sales Channel Partner (SCP) for the French market, effective May 2024.
Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers
12/18/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co., Ltd. (GlobalWafers), of up to $406 million under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.