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Enabling a New Paradigm for Flexible, Point of Need Design and Manufacturing
March 18, 2024 | DARPAEstimated reading time: 1 minute
The Department of Defense (DOD) needs the flexibility to manufacture critical structures at the time and point of need using locally available materials. Yet current manufacturing approaches for forward production operate under the assumption that pristine raw materials will be readily available; furthermore, any change in material input would require costly redesign. This means that structure designs are reliant on fixed inputs to produce fixed outputs, hindering the flexibility required for forward production where raw materials and resources are limited.
DARPA’s new Rubble to Rockets (R2) program aims to overcome current limitations to manufacturing in supply chain-denied environments by developing production and design approaches that can accommodate widely variable input materials. Performers will focus on creating an inexpensive, flexible, and robust platform for the production and characterization of raw material for use in structural fabrication. They will then seek to apply that platform to adaptively update a sounding rocket’s structural design.
“Existing manufacturing approaches require stability. Building a framework that can enable the manufacture of structures out of anything, anywhere, and at many sizes would break the status quo for manufacturing in resource-contested environments,” said Hunter Martin, DARPA’s program manager for the R2 program. “We’re focusing on sounding rockets for proof of concept because they represent a single-use structure with multiple components and complex structural requirements, but anticipate broad applicability to a wide range of manufacturing use cases – from spare parts and infrastructure repair to system production.”
R2 will also look to leverage material informatics and innovative processing and manufacturing techniques to dramatically drive down the timeframes and scale needed for production.
DARPA hypothesizes that the analytical framework R2 aims to develop would allow for rapid upgrades to incorporate the growing number of new material developments and fabrication methods, thus significantly reducing adoption risk that traditionally can take decades to retire. Additionally, advances in material conversion and learnings from the program may open entirely new spaces for highly available material with a lower-risk supply chain and energy footprint.
DARPA will share further details on R2 in a forthcoming Program Solicitation (PS). An R2 Industry Day is scheduled for Mar. 18, 2024, to provide information to potential proposers on the objectives of the program.
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Brian O’Donnelly Appointed to Expanded Role, Strengthening Global Leadership to Drive Growth in the Fujifilm’s Electronic Materials Business
07/31/2025 | FujifilmFUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business.
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
07/31/2025 | UCLA NewsroomA new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA.
Creating a Design Constraint Strategy
07/24/2025 | I-Connect007 Editorial TeamMost designers learn how to set their design constraints through trial and error. EDA vendors’ guidelines explain how to use their particular tools’ constraints, and IPC standards offer a roadmap, but PCB designers usually develop their own unique styles for setting constraints. Is there a set of best practices for setting constraints? That’s what I asked Global Electronics Association design instructor Kris Moyer, who covers design constraints in his classes.
Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
07/28/2025 | I-Connect007In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
07/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsIf you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.