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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2024
March 25, 2024 | BenmayorEstimated reading time: Less than a minute
Benmayor will exhibit Technosystem Automation at the IPC APEX EXPO 2024, a world-class trade show and cutting-edge technical conference in Anaheim, California, April 6-11, in booth 4432 at Burkle North America (Schmoll).
Technosystem will present highly advanced automation concepts for the PCB industry, featuring Technosystem V3 LDI. This automation is specifically designed for mid-size PCB factories with a high mix and a substantial layer count, where delicate handling is paramount.
The new automation featured at the show will automate the Solder Mask or Dry Film Schmoll MDI Direct Imaginer. The Technosystem V3 LDI can automate all DI or LDI on the market and is equipped with a fully integrated protocol with the ability to manage job queues and make changes without downtime. All Technosystem Automations are prepared for the Industry 4.0.
Visit us at booth 4432 at Burkle North America (Schmoll) to learn more about Technosystem Automation from Benmayor. We look forward to speaking with you.
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