Insulectro’s Technology Village to Feature 35 Powerchats at IPC APEX EXPO

Estimated reading time: 5 minutes

Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.

Its 1800 sqft megabooth will be configured as a Technology Village with “store fronts” occupied by suppliers and a “Town Square,” that is home to PowerChats™.

The Insulectro PowerChats™, presented every 30-minutes, provide details on new products, processes and services offered by Insulectro and key suppliers EMC Arlon, DuPont, Pacothane®, InduBond®, Celanese Micromax™, and Kyocera.

“We are pleased to continue our PowerChats™,” commented Ken Parent, Chief Operating Officer, “Our outstanding expert presenters have crafted short, 13.5-minute, info-packed learning sessions where attendees will learn the WHAT/WHY/HOW on critical topics. Bottom line? All you need to know in 13.5-minutes.

“New products and technologies can change the way a board is designed and fabricated. In our field testing, we often hear ‘We could have never made this board before’,” continued Parent. “We’re anxious to share what we’ve learned in very concise presentations inside our booth (Space 3306).”

Insulectro Vice President of Technology Chris Hunrath agrees, “Our PowerChats™ have been enormously popular throughout the years. Often, it’s standing room only.

“That’s due to the intriguing topics we spotlight in our chats. This year is no exception. We have an incredible lineup of topics and presenters.

“You could spend the day with us every day of the show. So come and join us!”

IPC@IPC Product Power Chats Schedule for Booth 3306:

TUESDAY, April 9, 2024

10:30 am        Polyimide Builds with Heavy Copper Features
Norm Berry – Insulectro & Mark Carlson, Arlon / EMC

11:00 am        InduBond® - the Performance of Lamination
Kevin Barrett, Product Manager – Equipment

11:30 am        HT Polyimide Ink Series for High Temp Apps
Hee Hyun Lee, Lead Scientist – Celanese Micromax

12:00 pm        The Science & Art of Panel Plate Via Filling
Brandon Sherzer, Technical Service Consultant, DuPont

12:30 pm        Silveron™ GT-210 for High Reliability Connectors
Walt Forgacs, Plating Sales Manager, DuPont 

1:00 pm          Future is Heating Up: Introducing Pyralux® ML
Greg Roettger, Sr. Strategic Key Account Manager – DuPont 

1:30 pm          Kyocera’s Expertise in PCB & MIT Tooling
Uwe Heinrich, Global Sales Manager – Kyocera

2:00 pm          DuPont Advanced Riston® Dry Films
Rich Wessel, Technical Service Sr Consultant, DuPont

2:30 pm          New Thin Glass Reinforcement Options
Norm Berry & Chris Hunrath, Insulectro

3:00 pm          DuPont’s Powerhouse Portfolio
Cecily Andes & Shashi Gupta, DuPont Films & Laminates

3:30 pm          Arlon 86HP, not your Grandfather’s Polyimide
Norm Berry & Chris Hunrath, Insulectro 

4:00 pm          Enabling Next-Gen Automotive Technologies
Shannon Dugan, Lead Application Engineer, DuPont

4:30 pm          RF & Antenna PCBs: Non-fluoropolymer Dielectrics
Mitchell Benson & Chris Hunrath – Insulectro

5:00 pm          Flex and Rigid Flex Drilling and Milling
Charlton (CC) Carson, Kyocera PCB & Micro Industrial Tools

5:30 pm          Resin Bond 330
Chris Hunrath, VP of Technology - Insulectro

WEDNESDAY, April 10, 2024

9:30 am          Resin Bond 330
Chris Hunrath, VP of Technology - Insulectro

10:00 am        Meet the New PACO•MT Press Pad 
Lahcen Kiharty, Product Development - Pacothane

10:30 am        Advanced Materials and HDI
John Basel, KYOCERA PCB & Micro Industrial Tools  

11:00 am        DuPont’s Powerhouse Portfolio
Cecily Andes & Shashi Gupta, DuPont Films & Laminates

11:30 am        Kyocera’s Expertise in PCB & MIT Tooling
Uwe Heinrich, Global Sales Manager – Kyocera

12:00 pm        The Science & Art of Panel Plate Via Filling
Brandon Sherzer, Technical Service Consultant, DuPont

12:30 pm        Microvia Reliability, CTE by the Numbers
Norm Berry & Chris Hunrath, Insulectro

1:00 pm          Interra®: Quieting Your Power Distribution
Jin-Hyun Hwang, Lead Engineer Technical Service, DuPont

1:30 pm          RF & Antenna PCBs: Non-fluoropolymer Dielectrics
Mitchell Benson & Chris Hunrath – Insulectro

2:00 pm          Enabling Next-Gen Automotive Technologies
Shannon Dugan, Lead Application Engineer, DuPont 

2:30 pm          Future is Heating Up: Introducing Pyralux® ML
Greg Roettger, Sr. Strategic Key Account Manager – DuPont

3:00 pm          Arlon 86HP, not your Grandfather’s Polyimide
Norm Berry & Chris Hunrath, Insulectro

3:30 pm          Silveron™ GT-210 for High Reliability Connectors
Walt Forgacs, Plating Sales Manager, DuPont 

4:00 pm          HT Polyimide Ink Series for High Temp Apps
Hee Hyun Lee, Lead Scientist – Celanese Micromax™

4:30 pm          Polyimide Builds with Heavy Copper Features
Norm Berry – Insulectro & Mark Carlson, Arlon / EMC 

5:00 pm          Paste with Ultra-Thin Foils for Build-Up HDI
Catherine Gallagher - EMD Electronics

5:30 pm          New Thin Glass Reinforcement Options
Norm Berry & Chris Hunrath, Insulectro

THURSDAY, April 11, 2024

9:30 am          New Thin Glass Reinforcement Options
Norm Berry & Chris Hunrath, Insulectro

10:00 am        Polyimide Builds with Heavy Copper Features
Norm Berry – Insulectro & Mark Carlson, Arlon / EMC

10:30 am        Microvia Reliability, CTE by the Numbers
Norm Berry & Chris Hunrath, Insulectro

11:00 am        InduBond® - the Performance of Lamination
Kevin Barrett, Product Manager – Equipment          

11:30 am        Connected Factory
Chris Hunrath, VP of Technology - Insulectro

All Power Chats are in Space #3306 at IPC APEX EXPO. No sign-up required. For further information, visit our website – www.insulectro.com .