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The IMAPS Show: A Conversation with John Andresakis
March 26, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
Suggested Items
Thailand Electronics Circuit Asia 2024 Kicks Off
07/24/2024 | Nolan Johnson, I-Connect007After a long and grueling experience through last week’s airline IT meltdowns, I finally touched down in Bangkok, where I’m here for the inaugural Thailand Electronics Circuit Asia (THECA) show. The expo and technical conference kicked off Wednesday at the Bangkok International Trade and Exhibition Center, featuring an expo and a technical conference.
An Interview With My Mentor, Christina Rutherford
07/17/2024 | Hannah GraceI first came to IPC APEX EXPO as a Student Board Member, and during my time on the board, I discovered that the show is not just another endpoint to a conference, but a launching pad for ideas, connections, and inspiration that lasts for decades. As participants leave the conference, they continue sharing knowledge and experiences that linger, affirming the enduring significance of IPC APEX EXPO in shaping the future of electronics.
SEMICON West 2024 Preshow Interview, FLEX Conference Review
07/03/2024 | Marcy LaRont, PCB007 MagazineIn this preshow interview for SEMICON West 2024 and the FLEX Conference, we dive into the dynamic world of semiconductor and flexible electronics, revealing cutting-edge insights from industry leaders with SEMI’s Samer Bahou, Gity Samadi and Julie Rogers and Bob Praino from Chasm Advanced Materials who advises the FLEX program. Set against the backdrop of the prestigious Moscone Center in San Francisco, the discussion traverses the history, evolution, and future directions of this critical sector, spotlighting the CHIPS Act, the importance of flexible and hybrid electronics technology for the sector going forward, and touches on issues such as sustainability and workforce. Here’s why you should be attending SEMICON West 2024 and FLEX Conference.
Exhibitor Registration Opens for 2024 NEDME Expo
06/17/2024 | NEDMEThe Electronics Manufacturers Association of Oregon (EMA) and the Electronics Representatives Association (ERA) are delighted to announce that Exhibitor registration for the 2024 NW Electronics Design & Manufacturing Expo (NEDME) is now open. The expo will take place on Wednesday, October 30, 2024, from 8:00 AM to 4:00 PM at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This is the first year that the event will be held at this newer, larger event center.
OE-A at ICFPE 2024, Taipei, Taiwan
06/11/2024 | OE-AThe International Conference on Flexible and Printed Electronics (ICFPE 2024) takes place from August 28-30, 2024, in Taipei, Taiwan. OE-A is a partner of this event and organizes a conference session.