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AT&S Well Prepared to Benefit from AI Boom
March 26, 2024 | AT&SEstimated reading time: 2 minutes

The rapid progress in the development of artificial intelligence promises to revolutionize all areas of daily life in the coming years. In order to operate such AI systems, an enormous amount of computing power is required, which is provided by a vast network of data centres. This digital infrastructure is already responsible for 2 to 3 percent of global electricity demand and the predicted growth rates are enormous. The key to a sustainable AI revolution lies in the efficient operation of these data centres. AT&S’s embedding technology enables a significant reduction of losses in the power supply of AI processors.
“Our know-how makes it possible to build power supply modules for AI data centres that deliver unmatched efficiency in the smallest of spaces. This significantly reduces the energy requirements and operating cost of data centres, which serves as a perfect example of our vision for the future: green technology for sustainable growth,” says AT&S CEO Andreas Gerstenmayer.
New AI customers
AT&S will start to produce cutting-edge IC Substrates for AMD later this year, delivering an integral part of their high-performance data processors for computers, datacentres and AI-infrastructure. Other renowned manufacturers of AI hardware are also relying on leading technology by AT&S: Just recently, two fabless semiconductor companies from the US that specialize in hyper-scale cloud infrastructure, edge computing and AI server microprocessors were added to AT&S’s growing AI customer portfolio.
“AI is growing exponentially and AT&S benefits from this boom, even more so with the growing demand for green solutions. AI can only be sustainable if power consumption is reduced. Our technology enables innovative solutions like the ultra-efficient power supply modules that are delivered by some of our customers to the AI industry. Our technology can make a huge difference in energy consumption and costs, which is reflected in the increasing demand for our power electronic solutions”, says AT&S CEO Andreas Gerstenmayer.
Key technology: Embedded component packaging
AT&S’s key technology for AI solutions is embedding. Embedded component packaging (ECP®) makes it possible to place microcontrollers, resistors and other components freely within a PCB. This allows AT&S to accommodate additional functionality in a smaller space. As they are thinner and more compact, ECP® circuit boards also allow the heat generated in electronic systems to be dissipated more efficiently.
“Renewable energy and intelligently controlled, efficient data networks are the basis for sustainable economic growth. We are proud to be able to make an important contribution in cooperation with leading AI companies,” says Gerstenmayer.
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Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.