-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Well Prepared to Benefit from AI Boom
March 26, 2024 | AT&SEstimated reading time: 2 minutes

The rapid progress in the development of artificial intelligence promises to revolutionize all areas of daily life in the coming years. In order to operate such AI systems, an enormous amount of computing power is required, which is provided by a vast network of data centres. This digital infrastructure is already responsible for 2 to 3 percent of global electricity demand and the predicted growth rates are enormous. The key to a sustainable AI revolution lies in the efficient operation of these data centres. AT&S’s embedding technology enables a significant reduction of losses in the power supply of AI processors.
“Our know-how makes it possible to build power supply modules for AI data centres that deliver unmatched efficiency in the smallest of spaces. This significantly reduces the energy requirements and operating cost of data centres, which serves as a perfect example of our vision for the future: green technology for sustainable growth,” says AT&S CEO Andreas Gerstenmayer.
New AI customers
AT&S will start to produce cutting-edge IC Substrates for AMD later this year, delivering an integral part of their high-performance data processors for computers, datacentres and AI-infrastructure. Other renowned manufacturers of AI hardware are also relying on leading technology by AT&S: Just recently, two fabless semiconductor companies from the US that specialize in hyper-scale cloud infrastructure, edge computing and AI server microprocessors were added to AT&S’s growing AI customer portfolio.
“AI is growing exponentially and AT&S benefits from this boom, even more so with the growing demand for green solutions. AI can only be sustainable if power consumption is reduced. Our technology enables innovative solutions like the ultra-efficient power supply modules that are delivered by some of our customers to the AI industry. Our technology can make a huge difference in energy consumption and costs, which is reflected in the increasing demand for our power electronic solutions”, says AT&S CEO Andreas Gerstenmayer.
Key technology: Embedded component packaging
AT&S’s key technology for AI solutions is embedding. Embedded component packaging (ECP®) makes it possible to place microcontrollers, resistors and other components freely within a PCB. This allows AT&S to accommodate additional functionality in a smaller space. As they are thinner and more compact, ECP® circuit boards also allow the heat generated in electronic systems to be dissipated more efficiently.
“Renewable energy and intelligently controlled, efficient data networks are the basis for sustainable economic growth. We are proud to be able to make an important contribution in cooperation with leading AI companies,” says Gerstenmayer.
Suggested Items
Rocket Lab Onramped to Multi-Billion Dollar U.S. and U.K. Defense Contracts
04/15/2025 | BUSINESS WIRERocket Lab USA, Inc., a global leader in launch services and space systems, announced it has been selected to provide hypersonic test launch capability with its HASTE launch vehicle, engineering expertise, and other services through its participation in two multi-billion dollar government development programs for the United States and the United Kingdom.
Hon Hai Product Chief Xiao Caiyou Elected as Member of the Board of Directors of the NAM
04/15/2025 | Hon Hai Technology GroupHon Hai Technology Group, the world’s largest technology manufacturing and service provider, announced that Jerry Hsiao, Chief Product Officer and General Manager of the U.S. Regional Headquarters, has been invited by the National Association of Manufacturers ( NAM ) to officially join the NAM Board of Directors to help promote the competitiveness of the U.S. manufacturing industry and related policy initiatives.
Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
04/11/2025 | AvnetDesign engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing
04/11/2025 | PRNewswirePCBAIR, a leading provider of PCB manufacturing and assembly services with fully automated production lines, announced that it is increasing funding for research and development to incorporate AI into its manufacturing processes, dramatically improving defect prediction accuracy and efficiency.
TSMC, ASE Join Forces with 100+ Companies to Drive Silicon Photonics Technology Integration
04/11/2025 | SEMIThe SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar today, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization.