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Unique Look Behind the Scenes of AT&S Research

05/23/2024 | AT&S
The technology leader AT&S already holds almost 800 patents and is giving an insight into its R&D departments in Leoben at the “Long Night of Research” on May 24. But some things remain top secret: the new research center and Europe’s first substrate plant recently installed a high-tech machine that is unique in the world. It allows the exposure of substrate structures that are 14 times thinner than a human hair.

The Rise of Collaborative Intelligence in Manufacturing

05/22/2024 | Jennifer Davis, Arch Systems
Every modern manufacturer grapples with a common challenge: extracting actionable insights from the ever-growing sea of operational data. The challenge of the data deluge isn’t just overwhelming; it coincides with a broader shift in automation needs. While traditional forms of automation, such as robots, remain vital, the focus is expanding to encompass automating the very intelligence needed to run a factory efficiently. As a result, a new generation of tools and technologies, including artificial intelligence (AI) is beginning to transform the way factories operate.

Dana on Data: The Insane PCB DFM Process

05/22/2024 | Dana Korf -- Column: Dana on Data
This industry just doesn’t like to change. Line width/space is consistently narrowed; layer counts are now over 120 layers; via diameters constantly shrink. But a fabricator still can’t build per the supplied data package because of design, document, and capability mismatch errors. I have been writing for I-Connect007, and of the 41 articles and interviews I have done, 39 have focused on highlighting designer-to-fabricator data transfer issues with proposed solutions. Little has changed to improve the transfer. This industry seems to accept receiving erroneous PCB data.

The Data Brings Us Together

05/22/2024 | Nolan Johnson, I-Connect007
IPC APEX EXPO 2024 wrapped up after a week of immersion in printed circuits and electronics manufacturing, so why did I keep thinking about wood joinery as I flew home rather than fabrication and assembly?

Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules

05/22/2024 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.
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