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ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
March 27, 2024 | SEMIEstimated reading time: 1 minute
More than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York. Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability will come into sharp focus. Registration is open.
Featuring keynotes by thought leaders from IBM, Wolfspeed, and Semiconductor Advisors, ASMC 2024 is the premier event where industry professionals network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Bradley Wood, Applications Engineering Manager, CMP Filtration at Entegris, and Vijayalakshmi Seshachalam, CVD Process Engineer Lead at GlobalFoundries.
ASMC will also feature the workforce development panel discussion Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce. Panelists will include:
- Fran Dillard, Vice President and Chief Diversity Inclusion Officer, Micron
- Kylie Patterson, Senior Advisor, CHIPS for America
- Héctor M. Rodríguez, Ph.D., Professional Engineer, Dean of Science, Technology, Engineering and Math, Hudson Valley Community College
- Kevin Younis, COO and Executive Deputy Commissioner, Empire State Development
ASMC 2024 technical sessions will cover topics including:
- 3D, TSV, and Novel Advanced Silicon Processing
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Process Control
- Advanced Semiconductor Technologies
- Big Data Management and Mining
- Contamination Free Manufacturing
- Defect Inspection
- Equipment Optimization
- Factory Automation
- Manufacturing for Sustainability
- Smart Manufacturing / Industrial Engineering
- Yield Enhancement / Yield Methodologies
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
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09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
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On the Line With… Podcast: UHDI and RF Performance
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The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).