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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
March 27, 2024 | SEMIEstimated reading time: 1 minute
More than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York. Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability will come into sharp focus. Registration is open.
Featuring keynotes by thought leaders from IBM, Wolfspeed, and Semiconductor Advisors, ASMC 2024 is the premier event where industry professionals network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Bradley Wood, Applications Engineering Manager, CMP Filtration at Entegris, and Vijayalakshmi Seshachalam, CVD Process Engineer Lead at GlobalFoundries.
ASMC will also feature the workforce development panel discussion Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce. Panelists will include:
- Fran Dillard, Vice President and Chief Diversity Inclusion Officer, Micron
- Kylie Patterson, Senior Advisor, CHIPS for America
- Héctor M. Rodríguez, Ph.D., Professional Engineer, Dean of Science, Technology, Engineering and Math, Hudson Valley Community College
- Kevin Younis, COO and Executive Deputy Commissioner, Empire State Development
ASMC 2024 technical sessions will cover topics including:
- 3D, TSV, and Novel Advanced Silicon Processing
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Process Control
- Advanced Semiconductor Technologies
- Big Data Management and Mining
- Contamination Free Manufacturing
- Defect Inspection
- Equipment Optimization
- Factory Automation
- Manufacturing for Sustainability
- Smart Manufacturing / Industrial Engineering
- Yield Enhancement / Yield Methodologies
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