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SMTA Conducts First UHDI Symposium
March 29, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes
Finally, in his presentation “Design & Verification of UHDI Topologies,” Stephen Chavez of Siemens talked about automation and verification, highlighting that today’s design tools have the horsepower for collaborative working. He emphasized an absolute need for 3D simulation modeling, and reinforced the reality of machine automation and AI, saying that the day will come when AI will be able to design a board, and good designers will have job security because they will take advantage of all of the benefits that AI has to offer PCB design.
The meeting was held at the Peoria Sports Complex in Phoenix’s West Valley, the spring training base for both the San Diego Padres and the Seattle Mariners, who played the season’s very last spring training game later that day, just outside the meeting room doors. The unique and very Arizona ambiance turned out to be a perfect backdrop for the energy and enthusiasm of the conference. The day was end-capped by a hosted cocktail and networking hour, where lively discussions continued, and old friends caught up.
If there was one criticism of the day, it was that folks would have liked more time allocated to networking and casual discussion, but that speaks more to the success of the event and a deep need for this level of information and conversations to continue, something SMTA is looking to address in an ongoing and interactive way.
Congratulations to Tara Dunn and the SMTA team for this first and very successful UHDI Symposium. We have been assured that there will be a second one in March 2025, again in Peoria, so mark your calendars. All SMTA UHDI presentation slides will be available at smta.org.
Page 2 of 2Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
07/15/2025 | I-Connect007 Editorial TeamAmerican chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.
IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
07/15/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.
I-Connect007 Observes U.S. Independence Day Holiday
07/04/2025 | Nolan Johnson, I-Connect007Today marks the 248th anniversary of the signing of the American Declaration of Independence by the Continental Congress. Known widely in the U.S. as Independence Day or “The Fourth of July,” this day also commemorates the declaration by the Congress that the American colonies are free and independent states.
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLCMRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).