MKS’ Atotech, ESI to Participate in IPC APEX EXPO

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MKS’ Atotech and ESI will participate in this year’s IPC APEX EXPO 2024, the PCB industry’s largest event in North America, to be held in Anaheim, California, to be held from April 6-11 2024 at the Anaheim California Convention Center. This year the IPC APEX EXPO will also host the Electronic Circuits World Convention 16 (ECWC16).

Representing its strategic brands, Atotech® and ESI®, MKS will showcase its latest products and solutions for PCB and package substrate manufacturing, ranging from chemical processes, production systems, auxiliaries, and lasers to software solutions for optimized production yield, reliability, and efficiency.

By combining leading capabilities in lasers, optics, motion, process chemistry, and equipment, MKS is uniquely positioned to Optimize the InterconnectSM, a key enabler for the next generation of advanced electronics, which represents the next frontier in miniaturization and complexity. The Optimize the InterconnectSM philosophy underscores the company’s unique position to support the development of next-generation advanced PCB and package substrate manufacturing solutions for its customers and partners. We are highly committed to enabling new technologies and smaller feature sizes by combining MKS’ ESI laser drilling technologies with MKS’ Atotech chemistry and plating equipment.

“Cultivating synergies in North America, our combined offering brings together the best of both worlds, seamlessly integrating diverse expertise and resources to drive unparalleled success. Together, the collective power of innovation and strategic alignment unlocks new opportunities and delivers impactful results,” said Rodney Goodrich, Business Manager Electronics North America.

Experts from both brands will be available to discuss the latest industry trends and challenges at IPC APEX EXPO booth 4412. The dedicated on-site team will showcase new product combinations, including printed circuit board manufacturing equipment (wet-to-wet process equipment, laser systems, and auxiliary equipment), chemistry, software, and related services.

On the chemistry side, our highlights include:

Neoganth® E Activator: Cost-efficient activator for MLB, HDI, and rigid-flex production in horizontal equipment
Noviganth® AF 76: Vertical, high build, self-accelerating electroless copper
Cupracid® TP3: Conformal copper plating for vertical hoist-type systems
InPro® MVF2: Next-generation blind micro via filling for HDI production
EcoFlash® S 300: Differential etching for advanced SAP manufacturing
CupraEtch® SR8000: Dryfilm and solder mask pretreatment with advanced adhesion performance
PD-Core®: Low metal electroless palladium bath for ENEPIG and EPAG applications
Aurotech® G-Bond 3: New gold electrolyte with autocatalytic properties and non-toxic stabilization

Our equipment highlights for PCB manufacturing are:

vPlate®: Vertical continuous copper plating equipment
Uniplate® P, LB, CP/NP, IP2: Equipment for desmear, electroless Cu, direct metallization, and electrolytic Cu plating

On the laser equipment side, promotions include:

GeodeTM G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via
CapStoneTM Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%

ESI and Atotech will present their expertise in a series of paper presentations, here are the details:

Wednesday, April 10, 8:00 a.m. – 10:00 a.m.
“The Impact of Final Finishes and Thermal Aging on Insertion Loss at Frequencies up to 150 GHZ”
Speaker: Britta Schafsteller | Global Product Manager Selective Finishing, MKS Atotech

Wednesday, April 10, 10:30 a.m. – 12:00 a.m.

“Maximize Throughput with Innovative Laser/optics Configuration, Precision Pulse Shaping, and Steering Designed for ABF Materials”
Speaker: Kyle Baker | Product Marketing Specialist, MKS Instruments, Inc.
and
“Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization”
Speaker: Manuel Galvez | Product Marketing Manager, N.A., MKS Atotech

 Wednesday, April 10, 1:30 p.m. – 3:00 p.m.
“Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation”
Speaker: Chris Ryder | Director of Business Development, MKS Instruments, Inc.
and
“New solutions for inclusion-free copper filling of through vias for latest generation Substrates designs”
Speaker: Kuldip Johal | Global OEM Pathfinding Senior Director, MKS Atotech

Conference: IPC APEX EXPO 2024
Date:   April 6-11, 2024
Booth: 4412
Venue: Anaheim Convention Center