Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
I-Connect007 Adds to Technical Library With Book on Factory Analytics by Cogiscan
April 3, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights. Thirty-eighth in a series of educational technical books published by I-Connect007, this book is a guide to understanding how analyzing your factory data is the key to competitive advantage for your factory.
Jason Sciberras, president of Saline Lectronics, offered his recommendation of the book, stating, “I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book.”
Download your free copy today at I-Connect007.com/fa.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights, by Cogiscan.
Share on:
Suggested Items
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
Gartner Forecasts MENA IT Spending to Grow 7.4% in 2025
11/20/2024 | Gartner, Inc.IT spending in the Middle East and North Africa (MENA) region is projected to total $230.7 billion in 2025, an increase of 7.4% from 2024, according to the latest forecast by Gartner, Inc.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
New Ultrafast Memory Boosts Intel Data Center Chips
11/19/2024 | IntelWhile Intel’s primary product focus is on the processors, or brains, that make computers work, system memory (that’s DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen).
Sluggish Telecom Market Growth Prompts Operators to Become Full-Stack Technology Suppliers
11/18/2024 | IDCWorldwide spending on telecommunications and pay TV services will reach $1,544 billion in 2024, representing an increase of 2.4% year-on-year, according to the Worldwide Semiannual Telecom Services Tracker published by International Data Corporation (IDC).