Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
I-Connect007 Adds to Technical Library With Book on Factory Analytics by Cogiscan
April 3, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights. Thirty-eighth in a series of educational technical books published by I-Connect007, this book is a guide to understanding how analyzing your factory data is the key to competitive advantage for your factory.
Jason Sciberras, president of Saline Lectronics, offered his recommendation of the book, stating, “I would recommend that any data-driven engineers focused on taking their manufacturing operations to the next level read this book.”
Download your free copy today at I-Connect007.com/fa.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights, by Cogiscan.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Soaring Inference AI Demand Triggers Severe Nearline HDD Shortages; QLC SSD Shipments Poised for Breakout in 2026
09/16/2025 | TrendForceTrendForce’s latest investigations reveal that the massive data volumes generated by AI are straining the global infrastructure of data center storage.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.