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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Collaboration and Innovation: Insights from SMTA's First UHDI Symposium
April 2, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Anaya Vardya provides valuable insights on industry collaboration and innovation at the first SMTA UHDI Symposium, delving into the necessity of collaboration in driving innovation and progress within our industry. He shares his experience in helping put this event together, and pride in being a part of bringing the UHDI test board to life.
Suggested Items
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.
UK, Cyprus Strengthen Space Ties
04/14/2025 | ESAThe first Cyprus-UK Bilateral Cooperation Event brought together representatives from the space sectors and governments of both countries, with the support of the European Space Agency (ESA).
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
L3Harris, Kuiper Government Solutions Partner on Resilient Satellite Communications Solutions
04/08/2025 | L3Harris TechnologiesL3Harris Technologies and Kuiper Government Solutions LLC (KGS), a subsidiary of Amazon.com, Inc., have partnered to deliver integrated, resilient Satellite Communications (SATCOM) solutions to governments and militaries worldwide.
NOTE Expands Collaboration with Waystream Group
04/02/2025 | NOTEAfter several years of successful collaboration for both parties, the Swedish telecom company Waystream has decided to appoint NOTE as the exclusive production partner of the company's products.