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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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Collaboration and Innovation: Insights from SMTA's First UHDI Symposium
April 2, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Anaya Vardya provides valuable insights on industry collaboration and innovation at the first SMTA UHDI Symposium, delving into the necessity of collaboration in driving innovation and progress within our industry. He shares his experience in helping put this event together, and pride in being a part of bringing the UHDI test board to life.
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Sweeney Ng - CEE PCBSuggested Items
GuRu, Uniquest, Arion Advance sUAS for Korean Defense
02/11/2026 | PRNewswireGuRu Wireless, Inc., a leader in advanced wireless power solutions for national security and defense applications, announced a strategic collaboration with Uniquest Corporation, a leading electronics distributor and manufacturer's representative in South Korea, and Arion, a developer of AI-enabled unmanned aerial systems (UAS) for defense and public-sector operations.
Arkema, Senior Strengthen Cooperation to Advance Next-Generation Battery Materials
02/05/2026 | BUSINESS WIREArkema, a global leader in Specialty Materials, and Senior, a global leader in battery separators technologies, have signed a Memorandum of Understanding (MoU) to further strengthen their long-term strategic cooperation and jointly advance innovation across the battery value chain.
Lockheed Martin, Fujitsu to Accelerate Dual-use Technology Development
02/02/2026 | JCN NewswireLockheed Martin and Fujitsu Limited announced a new Memorandum of Understanding (MOU) to jointly accelerate technology development in several critical areas, leveraging Lockheed Martin’s integrated systems expertise and Fujitsu’s world-leading technologies and commercial scale to advance innovation of dual-use capabilities.
Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins
01/29/2026 | John Watson -- Column: Elementary, Mr. WatsonChange sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room.
Foxconn, Pace CCS Launch Taipei Carbon Capture Lab
12/31/2025 | FoxconnFoxconn Technology Group and Pace CCS , a leading UK-based company in carbon capture and storage (CCS) design , jointly announced the opening of a laboratory in Taiwan to develop chemical injection technology to effectively prevent corrosion of internal CCS pipelines.