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Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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The World of Electronics and Standards: A Conversation with Frank Honyotski, STI
April 3, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Marcy LaRont of I-Connect007 speaks with Frank Honyotski of STI Electronics, who discusses the services offered by STI, including training, engineering, and failure analysis. He highlights his involvement with IPC standards development and emphasizes the importance of industry professionals engaging in standards development.
Suggested Items
'Let’s Talk Production Test' with Bert Horner of The Test Connection, Inc. at SMTA Long Island Meeting
04/02/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce that its President, Bert Horner, will present at the SMTA Long Island Chapter Technical Meeting & Dinner on Wednesday, April 16, 2025. The event will take place at the Radisson Hotel Hauppauge in Hauppauge, NY.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
04/02/2025 | TeradyneTeradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.
TRI Test Solutions at INNOELECTRO 2025
04/02/2025 | TRIAnytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.
Real Time with... IPC APEX EXPO 2025: Revitalizing the U.S. Microelectronics Industry with PCBAA
04/01/2025 | Real Time with...IPC APEX EXPOPCBAA president David Schild discusses his experience in the PCB and aerospace sectors, focusing on the mission of the PCBAA and its collaboration with IPC. He highlights the decline in PCB manufacturing in the U.S. and the importance of public policy in restoring capacity.