-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
The World of Electronics and Standards: A Conversation with Frank Honyotski, STI
April 3, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Marcy LaRont of I-Connect007 speaks with Frank Honyotski of STI Electronics, who discusses the services offered by STI, including training, engineering, and failure analysis. He highlights his involvement with IPC standards development and emphasizes the importance of industry professionals engaging in standards development.
Suggested Items
The 500 Largest Cellular IoT Deployments Together Account for 632 Million Units
12/23/2024 | Berg InsightBerg Insight presents its yearly updated database covering the 500 largest cellular IoT deployments identified as part of the company’s world-class IoT market research activities since 2004.
Merry Christmas from I-Connect007!
12/25/2024 | Marcy LaRont, I-Connect007Though a modern Christmas typically brings to mind vivid images of a jolly Santa Clause, excited children opening gifts on Christmas morning, and huge feasts on festive looking holiday tables, the great holidays in every culture and religious tradition comes with an interesting historical context.
The Effects of Copper on a Transmission Line
12/23/2024 | Todd Kolmodin, Gardien ServicesAs technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.
Season Group Acquires Pycom
12/18/2024 | Season GroupSeason Group – an international electronics design and manufacturing services provider headquartered in Hong Kong with sites in China, Malaysia, Mexico, and the U.K. – is pleased to announce its acquisition of all assets of Pycom Ltd, a full stack Internet of Things (IoT) company that provides a fully integrated IoT platform to build scalable connected solutions. Pycom Ltd went into administration in the UK on 16 September 2022.
American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
12/17/2024 | Shane Whiteside -- Column: American Made AdvocacyThis was a great year for the ongoing advocacy efforts for the PCB industry. Our numbers tell the story. PCBAA membership topped 65, we have more than 5,000 followers on social media, generated 450 social media posts, had more than 50 Capitol Hill meetings with members and staff, influenced PCB legislation, held our largest annual meeting to date, placed 12 opinion editorials in major publications across the country, and participated in four industry trade shows.