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Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available

07/25/2024 | I-Connect007
Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin.

iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/24/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.

Keysight, University of Malaga’s MobileNet Join Forces to Accelerate Open RAN Development with RAN Intelligent Controller Testing

07/23/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that the University of Malaga, specifically the MobileNet: Mobile & Aerospace Networks Lab within the Telecommunications Institute (TELMA), has selected its RAN Intelligent Controller Test Solutions (RICtest).

Flex Joins the Reverse Logistics Association

07/19/2024 | Flex
Flex announced it has joined the Reverse Logistics Association (RLA), a member-driven, global trade association for the returns and reverse industry and an authoritative body for reverse logistics best practices. Bringing more than two decades of experience in integrated reverse logistics and circular economy services at scale, Flex joins a community network of top service providers and decision makers from companies globally focused on advancing reverse logistics.

Hon Hai Research Institute Celebrates 50 Year at 2024 AI NExT Forum

07/19/2024 | Foxconn
Hon Hai Research Institute will celebrate the 50th anniversary of Hon Hai Corporation and will hold the "AI NExT Forum " at the National Taiwan University Conference Center on July 23.
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