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ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
April 3, 2024 | PRNewswireEstimated reading time: 1 minute

ENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems. While flexible printed circuits (FPC) are often employed in these systems, they are the most expensive component in the current collector assembly. ENNOVI's flexible die-cut circuit (FDC) technology offers a more cost-effective and sustainable solution, with fewer manufacturing procedures and faster continuous reel-to-reel production.
Generally, FPCs are manufactured using a multi-stage, batch photolithography process to etch copper traces for the flexible circuit. This production process uses corrosive chemicals that dissolve the unwanted copper. In addition, it takes a lot of time and energy to extract the waste copper from the chemicals, making it challenging to effectively recycle. The die-cutting process allows for instant recycling of the copper, making it a more substance preference to chemical etching.
Compared with FPCs, which have a size limitation of 600x600mm, FDCs boast no length restrictions as they are manufactured reel-to-reel. Under certain design considerations, the FDC provides similar performance characteristics to FPCs. These results were confirmed through rigorous in-house dimension, thermal shock, trace resistance, temperature rise, insulation resistance and high voltage testing.
"Adopting the FDC capability for flexible circuits aligns with our vision to think outside the box in creating a sustainable battery value chain for EVs," explains Gustavo Cibrian, Product Manager, Energy Systems, at ENNOVI. "Our efforts enable ENNOVI to offer battery manufacturers a CCA design solution that balances their imperatives in terms of cost, time and performance. Allowing them to design to cost."
Suggested Items
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.